Cheng-Yao Juan (阮晟堯)
Tel : +886-9 10978986 / Email : [email protected]
An independent and trained engineer with ODM experience,looking for a new journey in software field.
Always passionate and careful about discovering and researching , also be proficient in cross-team communication.
Software engineer in camera module team.Learning camera module design , image process , visual software algorithms and computer vision.
Hard Skills
•C Language (C / C++ / C#)
•Python / SQL / Fortran
•Linux / Visaul Studio / Git
•Computer vision (OpenCV , Image process)
•Visualization tool (Tableau)
•Camera module design
•Component function concatenate
Soft Skills
•Communication skills
• Cross-team collaborate
• Issue analysis and Problem solving
•Topic summarize and key points extraction
Work Experience
Software engineer • Liteon Techlonogy Dec,2022 - Present
•TOF camera module research / develop.
•Program design for product testing / manufacturing program with C / C++ / C#.
•Function calibration / validation.
•Research interface(I2C/SPI ...) and algorithm to develop component function.
Thermal engineer • Wistron Corporation May,2019 - Aug,2021
•Develop Dell CY 20 series product and get Wistron internal Gold Prize in 2020.
•Analyze thermal issues or unexpected behavior in hardware/ software and implement solutions.
•Optimize the system performance and Thermal / Acoustic validation.
•assessment , CAE and co-work with other teams for new project.
Education
Tibame Academy Apr,2022 - Aug,2022
AI & Data Science Program Class
- Data pre-process/analysis , Machine learning/Deep learning algorithm
National Cheng-Kung University Sep,2016 - Aug,2018
Master of Science in Applied Mechanic
• Major in Heat transfer,Solidfication ,Material Science and Fintie Element Method.
• Apply FEM and adaptive time step method to optimize Solidfication simulation
National Chung-Hsing University Sep,2012 - Aug,2016
Bachelor of Mechanical Engineering
