Job Description

1.Work with Contract Manufacturers to evaluate and validate manufacturing processes and possible failure modes

2.Technical issue resolution, establish lessons learnt practice and feedback to cross functional teams

3.Liaison between engineering and manufacturing for all aspects of hardware builds, include box builds, SMT assembly, die attachment, and wire bonding of microelectronics

4.Provide production support for manufacturing operations on a daily basis to remedy issues, enable on-time product deliveries, improve quality, and reduce cost, as well as analyze defect data and implement improvements to drive down defect rates

5.Maintain awareness of daily/weekly tasks/assignments to deliver products within the budgetary and schedule constraints. Work closely with the assembly, process technicians, material expediters/planners, production leads and operation program managers to ensure successful hardware fabrication

6.Participate in strategic supplier selection as needed for sustaining support

7.Support die attach and wire bonding, and other high precision assembly operations for wafer and module level packaging processes

8.Identifies and implements processes and product improvement opportunities at the suppliers to reduce manufacturing costs while improving the first past yield and product quality

Requirements

1.Bachelor’s degree in electrical, mechanical, or manufacturing engineering

2.8+ years of experience in manufacturing and hardware development of electronic products

3.Familiarity with manufacturing & SMT assembly process

4.Familiarity with Industry standards as they apply to circuit card and mechanical fabrication and assembly (IPC, JSTD, ASME, etc.)

5.Familiarity with properties and processes used in PWA assembly (Screen printing, SPI, pick and place, reflow oven, AOI, AXI, FPT, and ICT)

6.Understanding of lab analysis on PWB/A for DFX or failure

7.Familiarity with analytical tools and or failure analysis techniques (such as SEM, FTIR, Strain Gauge Analysis, EDX, SAM, and Optical Microscopy)

8.Experience with semiconductor/MEMS/GaN/GaAs process flows

9.Familiarity with Minitab, Mentor Graphics, Valor, Agile, and Oracle as plus

10.Familiarity with flex and rigid flex fabrication as plus

11.Ability to travel up to 50% domestic and international

12.Proficiency in English to be able to conduct technical and business discussions in the resource’s related field

13.Mandarin and English, Ability to influence through excellent written and verbal communications skills

Salary

650K ~ 900K TWD/year

Location

台灣新竹

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1111高階獵頭顧問中心

台北市南京東路五段89號14樓

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1111高階獵頭顧問中心為1111人力銀行之高階獵頭事業群

我們在台深耕多年,於各種領域皆具有豐富經驗,為廣大廠商與各界高階專業人才提供雙向、精緻的人才顧問服務。在獵人才、招募、求職,獵頭顧問等有專業豐富經驗,因應國際化人才及高端專業人才的需求迅速增加,我們提供專業、快速、精準的高規格獵頭服務,為海外地區及兩岸三地企業提供專業、精緻化的高規格獵才服務,為高階人才找到職涯晉階新舞台。

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