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EE硬體工程師
Job Description
職務說明:
1. 系統整合電路設計
2. Schematic Design/Layout review
3. 電路零件選用及BOM建立
4. 基板除錯電路Debug
5. 電子訊號, 電源量測和功能驗證
6. 熟悉ORCAD線路圖繪製、PADS或Allegro PCB layout工具、CAM350工具
7. 專案管理、產品開發及量產經驗
8. 文件撰寫能力
Requirements
1.大學以上電子電機相關系所畢
2.具電子硬體電路設計及相關驗證debug知識
3.具PCB layout相關知識
4.應用過『聯發科的晶片IC』或『高通的晶片IC』佳
**薪資依學經歷面議**
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香港商磐旭智能國際股份有限公司台灣分公司
51 - 200 people
About us
本公司股東：磐儀科技(台資上櫃)、聯發科(台資上市)、中國康佳集團(陸資官股)、美商掃描器大廠Code公司，公司登記在香港，磐儀科技主導經營管理。 產品：自行研發製造OEM、ODM手持裝置工業電腦等產品，用於物聯網與工業4.0產業。
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