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1.新產品開發與研發單位之間的橋樑。 2.新產品開發規劃與規格洽談。 ***薪資依學經歷面議***
1.新產品開發與研發單位之間的橋樑。 2.新產品開發規劃與規格洽談。 ***薪資依學經歷面議***
職務說明: 1. 系統整合電路設計 2. Schematic Design/Layout review 3. 電路零件選用及BOM建立 4. 基板除錯電路Debug 5. 電子訊號, 電源量測和功能驗證 6. 熟悉ORCAD線路圖繪製、PADS或Allegro PCB layout工具、CAM350工具 7. 專案管理、產品開發及量產經驗 8. 文件撰寫能力
職務說明: 1. 系統整合電路設計 2. Schematic Design/Layout review 3. 電路零件選用及BOM建立 4. 基板除錯電路Debug 5. 電子訊號, 電源量測和功能驗證 6. 熟悉ORCAD線路圖繪製、PADS或Allegro PCB layout工具、CAM350工具 7. 專案管理、產品開發及量產經驗 8. 文件撰寫能力
職務說明: 1. Android Apps/Tools/產測程式 開發 2. HTTP Server/PHP/MySQL 維護 (熟悉為佳) 3.網頁程式及Android手機App開發 **薪資依學經歷面議**
職務說明: 1. Android Apps/Tools/產測程式 開發 2. HTTP Server/PHP/MySQL 維護 (熟悉為佳) 3.網頁程式及Android手機App開發 **薪資依學經歷面議**