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研發工程類-資深/嵌入式軟體工程師 Senior/Embedded Software Engineer

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Job updated 11 months ago

Job Description

Responsibilities
• Design, develop, deploy and sustain hard real-time software system for semiconductor equipment.
• Develop software and firmware for various embedded controllers.
• Participate in development of machine integrating sub-module developed and drive for highest level of performance.
• Provide technical expertise and solutions to production and field for the deployment of controllers.
• Develop automated functional test jigs for electrical module production.

職責:
•設計、開發、部署和維護用於半導體設備的硬性即時軟體系統
•為各種嵌入式控制器開發軟體和韌體
•參與機器集成子模塊的開發,並開發驅動器以實現最高性能
•為生產現場提供技術專長和解決方案以部署控制器
•開發用於電氣模塊生產的自動化功能測試夾具

Requirements

Requirements
• Degree/Master/PhD in Electrical/Electronics/Automation/Computer Engineering
• Proficient in C/C++/C# programming skills
• Familiar with embedded processors such as microcontrollers, DSP, ARM etc, and various computer system architecture
• Sound understanding of real-time operating system, signal processing and control theory
• Knowledge in FPGA programming will be advantageous
• Experience with instruments like logic analyzer, oscilloscope, etc.
• Good understanding of electrical schematic design and PCB design skills will be an add-on advantage
• Strong interest and motivation in R&D work

要求:
•電機/電子/自動化/計算機工程專業的學位/碩士/博士學位
•精通C / C ++ / C#程式設計技能
•熟悉嵌入式處理器,例如微控制器、DSP、ARM等及各種計算機系統架構
•熟悉即時操作系統、信號處理和控制理論
•具有FPGA編程方面的知識為佳
•具有邏輯分析儀,示波器等儀器的經驗
•具有對電路圖設計和PCB設計技能了解為佳
•對研發工作有濃厚的興趣和動力

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1
1 years of experience required
60,000 ~ 80,000 TWD / month
Optional Remote Work
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About us

ASMPT is a leading, global supplier of semiconductor wafer processing equipment. Our smart and ambitious team is dedicated to delivering innovative technology solutions to the world’s leading semiconductor manufacturers. With over 2,200 employees based in 16 countries, including the United States, Netherlands, Belgium, Japan, South Korea, Singapore, and Taiwan. Together we work to develop thin-film deposition technologies for our customers through epitaxy, ALD, PEALD, vertical furnaces and PECVD. Our goal is to remain an industry leader by being ahead of what’s next. Focusing on finding collaborative solutions to make integrated circuits, or chips, smaller, faster and even more powerful.

Be part of our exciting future and join our team. Take a look on LinkedIn at our Careers tab in the top.



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