軟韌體研發工程師(ROG電競主機板)

Job Description

1. 最新世代Intel/AMD與Google市場產品韌體研發實作
2. 最新世代Microsoft Windows作業系統安全/技術功能研發實作
3. 業界PC週邊裝置先端技術研究及軟體開發
4. 華碩PC獨特韌體規格與創新技術制定
5. 華碩ROG電競 / Mini PC/Server產品新技術及Prototype原型機韌體開發
6. Utility&Debug tool開發
7. Windows Application development

Requirements

1. 大學以上電機、電子、資工、資管等相關系所畢
2. 邏輯思考佳、具有團隊合作精神
3. 熟悉C語言、X86或8051 組合語言
4. 有韌體開發經驗者佳
5. 薪資會依學經歷背景及相關工作經驗核薪

1
35K ~ 70K TWD/month
Optional Remote Work

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Asus 華碩電腦股份有限公司

臺北市北投區立德路15號

About us

華碩為美國《財富》雜誌評比「世界最受推崇企業之一」,並榮登美國《富比士》雜誌「全球最受信賴企業排行榜」及英國《路透社》「全球科技100強」。產品類別橫跨主機板、顯示卡、筆記型電腦、智慧手機、螢幕、路由器及全方位的科技產品解決方案,並積極拓展電競產品及開創AIOT新領域的各種應用。華碩致力追尋無與倫比的科技創新,為全球使用者創造體貼人心的智慧生活與無所不在的幸福感,以成為數位新世代備受推崇的科技創新領導企業為品牌願景。華碩擁有世界級研發菁英超過5,000人,產品行銷全球70多個國家,年營業額超過100億美元,每年獲獎數眾多,2018年平均每日獲得超過11個獎項,產品創新、設計及品質皆備受全球市場肯定。

Team

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