Company highlight

• A leading manufacturer of semiconductor for both array connect and leadframe assembly applications.
• Their technologically advanced equipment and integrated systems are used principally to produce semiconductor assemblies or packages.
• Their customers are leading U.S., European and Asian semiconductor manufacturers and assembly subcontractors.
• Products: Flipchip bonder, Die bonder, MCM die bonder, CMOS lensholder bonder, LCOS bonder, die sorting, packaging and plating equipment, Trim&Form, Singulation,ESEC

Responsibilities

• Research and develop new respectively enhance process technologies for actual or future customer requirements ( Analyze. Model, Calculate, Measure )
• Planing and execution of Lab trials to identify the correct processes and methodologies to be used
• Evaluate new packaging processes on our existing diebonder platform
• Co develop new machine Modules and its software out of the process view
• Definition of new specification for our interdisciplinary R&D team
• Interpretation, documentation and presentation of new results
• Support customers internally and externally
• Feedback field findings to the Headquarters
• Help to build up a Process lab in TW
• Actively lead teams and apply Process Engineering methodology
• Project Management concepts and tools at every stage of the project

Experience

Expertise and methodology

• Min 1~3 years of working experience mainly in Semiconductor Assembly industry
• Involved in the semiconductor wet-process application, support, and trouble-shooting of process or equipment related issues especially in the related segment, preferable Besi Plating product experience
• Good communicator in English language
• Strong analytical and trouble-shooting skills, providing excellent support to customers and end-users

Location:

新竹市

Feel free to contact me know if you are interested in this role, thank you:)

Email: [email protected]
LinkedIn: Jamie Liang / Mobile:0968511502/ Line ID:jamieisworking