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半導體設備外商 - Software Test Engineer - 新竹市 - PH

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Job updated over 1 year ago

Job Description

Company highlight

  • A leading manufacturer of semiconductor for both array connect and leadframe assembly applications.
  • Their technologically advanced equipment and integrated systems are used principally to produce semiconductor assemblies or packages.
  • Their customers are leading U.S., European and Asian semiconductor manufacturers and assembly subcontractors.
  • Products: Flipchip bonder, Die bonder, MCM die bonder, CMOS lensholder bonder, LCOS bonder, die sorting, packaging and plating equipment, Trim&Form, Singulation,ESEC

Requirements

Responsibilities

Timing analysis of software sequences for reaction time optimization.

  • Prepare test plans and procedure based on specification.
  • Prepare analysis concepts and document all measurements & results
  • Confer with software engineers and others regarding test procedures and results to resolve problems.
  • Create bug reports and follow through to closure.
  • Analyze technical requirements/problems and propose corrective actions/solution.
  • Provide technical support for the field and customer site.
  • Participate in software feature design review


Experience

  • Knowledge of controlling and programming of mechanical system
  • Experience at least 2 years in software testing and troubleshooting is a must
  • Good communication skills(English) in global environment
  • Knowledge of semiconductor industry
  • Experience in documentation

Interview process

If you would like to know any further info, feel free to contact me. Thank you!

> Line ID: phcr2021

> LinkedIn: Phoebe Huang

> Email: [email protected]

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