Company highlight

• A leading manufacturer of semiconductor for both array connect and leadframe assembly applications.
• Their technologically advanced equipment and integrated systems are used principally to produce semiconductor assemblies or packages.
• Their customers are leading U.S., European and Asian semiconductor manufacturers and assembly subcontractors.
• Products: Flipchip bonder, Die bonder, MCM die bonder, CMOS lensholder bonder, LCOS bonder, die sorting, packaging and plating equipment, Trim&Form, Singulation,ESEC

Responsibilities

Timing analysis of software sequences for reaction time optimization.

• Prepare test plans and procedure based on specification.
• Prepare analysis concepts and document all measurements & results
• Confer with software engineers and others regarding test procedures and results to resolve problems.
• Create bug reports and follow through to closure.
• Analyze technical requirements/problems and propose corrective actions/solution.
• Provide technical support for the field and customer site.
• Participate in software feature design review

Experience

• Knowledge of controlling and programming of mechanical system
• Experience at least 2 years in software testing and troubleshooting is a must
• Good communication skills(English) in global environment
• Knowledge of semiconductor industry
• Experience in documentation

If you would like to know any further info, feel free to contact me. Thank you!

> Line ID: phcr2021

> LinkedIn: Phoebe Huang

> Email: [email protected]