Company highlight

• A leading manufacturer of semiconductor for both array connect and leadframe assembly applications.
• Their technologically advanced equipment and integrated systems are used principally to produce semiconductor assemblies or packages.
• Their customers are leading U.S., European and Asian semiconductor manufacturers and assembly subcontractors.
• Products: Flipchip bonder, Die bonder, MCM die bonder, CMOS lensholder bonder, LCOS bonder, die sorting, packaging and plating equipment, Trim&Form, Singulation,ESEC

Responsibilities

• Timing analysis of software sequences for reaction time optimization.
• Prepare test plans and procedure based on specification.
• Prepare analysis concepts and document all measurements & results
• Confer with software engineers and others regarding test procedures and results
  to resolve problems.
• Create bug reports and follow through to closure.
• Analyze technical requirements/problems and propose corrective
  actions/solution.
• Provide technical support for the field and customer site.
• Participate in software feature design review

Experience

Expertise and methodology

• Knowledge of controlling and programming of mechanical system
• Experience in software testing and troubleshooting
• Experience in documentation
• Good communication skills in global environment
• Knowledge of semiconductor industry

Location:

新竹市

Feel free to contact me know if you are interested in this role, thank you:)

Email: [email protected]
LinkedIn: Jamie Liang / Mobile:0968511502/ Line ID:jamieisworking