Signal and Power Integrity Engineer

TSMC

TSMC work environment photoTSMC work environment photo

Job Description

【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://tinyurl.com/y25cfg7c

【Description】

  1. SoC/ASIC & package architecture design for high performance computing with High bandwidth Memory (Server, Networking, AI, AR…etc) applications.
  2. Execute SI/PI/RF/EMI validation for the system requirements on eye diagram, jitter, latency, IR drop, cross-talk, and SSN specs from chip to PCB.
  3. Develop system integration design and requirement based on SiP, PoP, PiP, Chip stacking, and other 3DIC technologies.
  4. Working with marketing/technology team on technology competitive analysis and develop package technology road map for future products requirements.

【Qualifications】

  1. Ph.D. in electrical engineering or communication engineering or Master's degree with 3 years working experience in SoC/NoC & package/integration co-design for high performance computing products.
  2. SoC/ASIC architecture & package knowledge and understanding of trade-offs made for partitioning of the key devices (AP, SoC, NoC, GPU, CPU...)
  3. Excellent written and spoken communication skills in English is required
  4. Hands-on participation and a strong sense of ownership is required
  5. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required

如欲投遞履歷,請上台積官網 http://www.tsmc.com/chinese/careers/index.htm

Share this Job

Please Sign in or Register to get your personal invite link.

TSMC

新竹市新竹科學工業園區研新二路6號

About us

Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore"​ wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.

TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.

The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.

TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM"​.

台積公司是全世界最大的專業積體電路製造服務公司。台積公司在民國七十六年成立於台灣新竹科學工業園區,並開創了專業積體電路製造服務商業模式。

領先的技術、卓越的製造,以及對於研發及產能投資的持續承諾,讓我們能夠在行動裝置、高效能運算、物聯網與車用半導體領域掌握商機。

台積公司的全球總部位於新竹科學園區,在北美、歐洲、日本、中國大陸、南韓、印度等地均設有子公司或辦事處,提供全球客戶即時的業務和技術服務。

See more

Learn more

Team

Default avatar

Similar Jobs

Garmin_電子工程師_汐止/ 林口

Garmin Ltd. 台灣國際航電股份有限公司 - Full-timeMid-Senior level1M ~ 1.5M TWD/yearUpdated about 1 month ago

(學生實習) Global Supply Chain Internship (Database)

Intel - Internship150 ~ 250 TWD/hourUpdated 6 months ago

Applications Engineer - PCB

Mentor Graphics - Full-timeMid-Senior levelUpdated 5 months ago

CakeResume Job Search

Tens of thousands of jobs listings. Salary transparency. Accurate and instant search experience.