Signal and Power Integrity Engineer


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Job Description



  1. SoC/ASIC & package architecture design for high performance computing with High bandwidth Memory (Server, Networking, AI, AR…etc) applications.
  2. Execute SI/PI/RF/EMI validation for the system requirements on eye diagram, jitter, latency, IR drop, cross-talk, and SSN specs from chip to PCB.
  3. Develop system integration design and requirement based on SiP, PoP, PiP, Chip stacking, and other 3DIC technologies.
  4. Working with marketing/technology team on technology competitive analysis and develop package technology road map for future products requirements.


  1. Ph.D. in electrical engineering or communication engineering or Master's degree with 3 years working experience in SoC/NoC & package/integration co-design for high performance computing products.
  2. SoC/ASIC architecture & package knowledge and understanding of trade-offs made for partitioning of the key devices (AP, SoC, NoC, GPU, CPU...)
  3. Excellent written and spoken communication skills in English is required
  4. Hands-on participation and a strong sense of ownership is required
  5. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required


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About us

Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore"​ wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.

TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.

The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.

TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM"​.




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