史恩維 En-Wei, Shih
Make it work, make it right, make it fast!
Taipei, Taiwan | 0972-374-885 | [email protected]
Education
National Taiwan University of Science and Technology
GPA: 4.19 / 4.3
Master, Computer Science. (2018 - 2020)
Tung Hai University
GPA: 3.0 / 4.0
Bachelor, Computer Science. (2012 - 2016)
Work Experiences
Micron Technology Inc. 美光科技
Data Scientist
(2021/11 - present)
Micron Technology Inc. 美光科技
Software Engineer
(2020/8 - 2021/11) 1 y 4 mos
Taishin Bank 台新銀行
Big Data Analyst Intern
(2019/9 - 2020/3) 7 mos
VIA Technologies Inc. 威盛電子
Machine Learning Software Engineer Intern
(2019/9 - 2019/1) 5 mos
Delta Electronics 台達電子
Big Data Analyst Intern
(2019/7 - 2019/8) 2 mos
GoTrust ID Inc. 動信科技
QA & UX Intern
(2015/2 - 2016/2) 1y 2 mos
Awards
TSMC x Microsoft CareerHack Hackathon
(2020/2)
2nd place, Automated Optical Inspection (AOI) Category
National Interdisciplinary Smart Electronic Competition
(2014/12)
Complete Design Award & Honorable Mention
Skills
Industrial knowledge
- Machine Learning
- Image Processing
- Information Retrieval
- Database
- 3D Printing
Programming Skills
- Python
- C++
- MATLAB
- SQL
Language Aptitude
- Chinese: Native
- English: TOEIC 705
