Semiconductor Process / Electrochemical Energy Storage material Research / X-Ray analysis
<Passion / Positive / Communication >
Semiconductor Wet clean Process tech 5nm → 3nm High-K metal gate
Electrochemical Energy Storage_The material research of Supercapacitor
Electrochemical analysis (CV , CP & EIS )
X-ray analysis (XRD , XAS , & XPS)
Middle End Wet Clean Process (High-K metal gate 5nm --> 3nm technology)
(2)Inline/offline SPC analysis and management
(3)Inline defect improvement
(4)Experiment analysis & Factor adjustment
(5)3nm technology tool inspection
Trouble shooting Experience
1.__The different of tools etching rate
We studied the paper about O3 chemical and worked with equiment engineer to finding the root cause then adjust the tool pipeline and the O3 generator concentration to solve the tools etching rate non-matching issue.
2.__Inline SPC target issue
By correlation to find pre-process recipe change then revise the target of SPC.
3.__Inline arcing defect issue
In order to solve defect issue by studying the property of etching chemical (HCl,DICO2 water & DI water) then arranged the sequence of doing etching chemical.
4.__ The different of etching chemical concentration
Two O3 generators concentration non-matching issue by studying the relationship between the O3 concentration and the amount of DICO2 mixing .By changing the pipeline of equiment to reduce O3 escaping .
1.Work -- Chemical /Lab mantaintion、Lab Keeper、MOST proposal apply
2.Research -- NSRRC X-ray Diffraction (XRD) , X-ray absorption spectroscopy (XAS) ,X-ray photoelectron spectroscopy (XPS) and the energy storage principle of supercapacitor
1.The thesis--High Working Voltage V2O5//MnO2 Asymmetric Solid State Supercapacitor
2.Paper publish --M.-J. Deng*, K.-W . Chen, Y.-C. Che,I.-J. W ang, C.-M. Lin,J.-M. Chen, K.-T. Lu, Y .-F.Liao, and H. Ishii, ACS Appl. Mater. Interfaces 2017, 9, 479−486
4.Foreign experiment-- To Japan Synchrotron Radiation Research Center(Spring-8) using high power XPS to analysis the energy storage principle of supercapacitor
2.Cyclic Voltammetry (CV)
3.Electrochemical Impedance Spectroscopy (EIS)
4.X-ray Diffraction (XRD)
5.X-ray absorption spectroscopy (XAS) 6.X-ray photoelectron spectroscopy (XPS)
1.Wet Clean Middle End Process
2.High-K metal gate