陳嘉豪

資深主任製程整合工程師

  • 6年半導體製程經驗
  • 負責SAMSUNG、NOVATECH、Dialog、REALTECH等大客戶
  • 掌管全廠最大量產品BCD
  • 成功改善超過40餘起案件
  • 完成2項公司A級專案
  • 訂定超過60餘項最佳化條件(BKM)
  • 熟悉多台機台操作

  新竹縣竹北市

  [email protected]

  +886 0989-929-413

工作經歷


UMC 聯華電子 - 資深主任製程整合工程師

一月 2017 - Present (5年)

  • 負責客戶:SAMSUNG, NOVATECH, Dialog, REALTECH, 致新...等
  • 負責產品:BCD(全廠最大產量)、Logic
  • 工作內容:
    • 開發新平台(Platform)
    • 改善跨製程問題
    • WAT異常及低良率(Low yield)的分析 / 改善 / 追蹤 / 預防 / 提升
    • 監控線上產品
    • 導入新產品
    • 客戶專案的推動 / 執行
    • 回覆客戶問題及處理客訴
  • 成就 / 貢獻:
    • 成功改善40餘起案子,其中超過20項重大案件
      • HVG issue, Optimize DTI process, leakage by frame fail, local failure map, Schottky leakage, metal bridging, donut-like failure map, metal fuse bridging, metal void...等
    • 參與A級專案"BCD Low Ron元件平台(Platform) 開發",與先進製程研發部門(ATD)合作改善device leakage及量測DC / TLP SOA
    • 完成A級專案"Samsung的客製化需求",成功開發本廠首顆5K高電阻(HR)元件
    • 訂定超過60項最佳化條件(BKM)以強化BCD母廠製程
    • 查過無數種WAT SPC alarm,有效的確查出異常原因,維持BCD製程穩定度
    • 熟悉多台機台操作
      • Keithley T300A(2657A), Keithley TLP, Agilent 4156, SEM, EDS, TTOX, ETOX, Leica...等
    • 前3年考績分別拿最好的"S"及2次A+,表現屢獲上司們的肯定








碩士學歷

Micron 美光科技 - 高級缺陷改善工程師

一月 2016 - 十二月 2016 (1年)

  • 負責產品:SI(Silicon interposer)
  • 工作內容:
    • 產品缺陷異常的分析 / 改善 / 追蹤 / 預防
    • 跨部門專案的推動 / 執行
    • 跨部門合作改善缺陷數量
    • 建立缺陷判定規範(Defect specification)及缺陷種類資料表(Defect category)
  • 成就 / 貢獻:
    • 成功解決影響全廠的Wafer edge low yield issue
    • 建立部門第一套缺陷判定規範(Defect specification)及缺陷種類資料表(Defect category)
    • 熟悉SEM, EDS, Leica機台操作

國立交通大學 - 電子工程學研究所

國立中央大學 化學工程與材料工程學研究所

  • 指導教授:侯拓宏, 周正堂 教授

  • GPA:3.8/4

  • 期刊:IOPscience - Homogeneous barrier modulation of TaOx / TiO2 bilayers for ultra-high endurance three-dimensional storage-class memory

  • 論文名稱:以快速熱氧化技術製作雙氧化層電阻式記憶體之研究 (Study of Double-layer Resistive Switching Random Access Memory Prepared by Rapid Thermal Oxidation)

  • 實驗地點:國家實驗研究院(NARLabs)

  • 成就 / 貢獻:

    • 成功做出學界第一個自我整流(Self-rectifying) 自我限流(Self-compliance)3D結構RRAM,並發表在IOPscience期刊
    • 親自進無塵室操作多種機台完成每道製程,清楚瞭解整套RRAM製程流程

2012 - 2014

2012 - 2014

技能


  • 半導體製程
  • 半導體物理
  • 半導體材料
  • 電性分析
  • 電性量測(DC/TLP SOA)
  • 良率分析
  • 資料統計分析
  • 風險評估分析及應對策略擬定
  • BCD 製程
  • BCD 元件分析

擅長工具


  Excel   PowerPoint   Word

語言


  • 中文
  • 英文 - TOEIC:760

Jia-Hao Chen

Senior Principal Process Integration Engineer(PIE)

  • 6 years' experience in semiconductor field
  • Responsible for major customers such as SAMSUNG, NOVATECH, Dialog, REALTECH, Global Mixed-mode Technology, etc.
  • In charge of the product BCD with maximum output in the whole factory
  • Successfully improved more than 40 cases
  • Finished 2 of our company's top projects
  • Defined more than 60 best known methods(BKM)
  • Specialize in operating numerous equipment

  Hsinchu, Taiwan

  [email protected]

  +886 0989-929-413

Work Experience

UMC - Senior Principal Process Integration Engineer

Jan., 2017 - Present (5 Years)

  • Client:SAMSUNG, NOVATECH, Dialog, REALTECH, Global Mixed-mode Technology, etc.
  • Product:BCD(With maximum output), Logic
  • Job Description:
    • Develop new platforms
    • Improve cross-process issues
    • Analyze / Improve / Track / Prevent WAT abnormalities and low yields
    • Monitor products on the production line
    • Import new products
    • Promote / Execute client’s projects
    • Respond to client’s problems and handle client complaints
  • Achievement / Contribution:
    • Successfully improved more than 40 cases, including more than 20 serious cases
      • HVG issue, optimize the DTI process, leakage per shot issue, local failure map, Schottky leakage, metal bridging, donut-like failure map, metal fuse bridging, metal void, etc.
    • Participated in the top project “Development of BCD low Ron device platform”, cooperated with Advanced Technology Development(ATD) to improve device leakage and measured DC/TLP SOA
    • Finished the top project “Customize for Samsung”, successfully developed our first 5K high resistance resistor(HR)
    • Defined more than 60 best known methods(BKM) to strengthen the BCD process
    • Investigated countless WAT SPC alarms
    • Specialize in operating numerous equipment
      • Keithley T300A(2657A), Keithley TLP, Agilent 4156, SEM, EDS, TTOX, ETOX, Leicaetc.
    • Got the best "S" and 2 "A+" in the past 3 years respectively, and have earned a lot of recognition from many supervisors





Micron - Senior Defect Engineer

Jan., 2016 - Dec., 2016 (1 Year)

  • Product:SI(Silicon interposer)
  • Job Description
    • Analyze / Improve / Track / Prevent abnormal defects
    • Promote / Execute cross-department projects
    • Cross-departmental cooperation to improve the defect level
    • Establish defect specification / category
  • Achievement / Contribution:
    • Successfully resolved the wafer edge low yield issue affecting the entire factory
    • Established the first defect specification / category in our department
    • Expert in operating SEM, EDS, Leica

Master’s Experience


National Chiao Tung University Electronics Engineering

National Central University Chemical and Materials Engineering

  • Advisor:Dr. Tuo-Hung Hou, Dr. Cheng-Tang Chou

  • GPA:3.8 / 4

  • Journal:IOPscience - Homogeneous barrier modulation of TaOx / TiO2 bilayers for ultra-high endurance three-dimensional storage-class memory

  • Thesis:Study of Double-layer Resistive Switching Random Access Memory Prepared by Rapid Thermal Oxidation

  • Laboratory:National Applied Research Laboratories(NARLabs) 

  • Achievement / Contribution:

    • Successfully made the first 3D structure RRAM with self-rectifying and self-compliance in academia, and published in IOPscience
    • Personally entered the clean room to operate numerous equipment to finish all the processes, very familiar with the entire RRAM process flow

2012 - 2014

2012 - 2014

Skills


  • Semiconductor Process
  • Semiconductor Physics and Devices
  • Semiconductor Materials
  • Electrical Analysis
  • Electrical  Measurement (DC/TLP SOA)
  • Yield Analysis
  • Data Statistical Analysis
  • Risk Assessment and Strategy Formulation
  • BCD Process
  • BCD Device Analysis

Tools


  Excel  PowerPoint  Word

Language


  • Chinese
  • English - TOEIC:760