Pin-Jun Chen

Northeast Asia 5G Management Trainee at Ericsson Group

  Taipei, Taiwan

5G Elite Trainee in Market Area North East Asia (MNEA) at Ericsson Group, based in Taipei, Taiwan. Former International Scholar at KU Leuven who focused on advanced electronic packaging technology, which is commonly used in IC and ICT industries. Moreover, I have served as an R&D Intern at imec, Belgium, a HW Intern at Qualcomm, and a Graduate Research Assistant at TSMC research center in NCTU, Taiwan.



Northeast Asia 5G Management Trainee  •  Ericsson

十一月 2020 - Present

5G Elite Trainee Program in North East Asia
• Under the coaching of the President of Ericsson Taiwan, Chafic Nassif.
• Be rotated into three core departments of Project Management, Product Management, and Sales within two years.
• Support the key account management (KAM) team with product and solution expertise focusing on 5G projects.

Research and Development Intern  •  Interuniversity Microelectronics Centre (imec)

一月 2020 - 五月 2020

Wafer Bonding Assembly Team
• Designed and conducted a novel process to fabricate 3D microfluidic devices with dry film resistance (DFR) technology.
• Manipulated laminator, bonder, and SAM to investigate the optimal parameter for the DFR process.

Hardware Engineering Intern  •  Qualcomm

五月 2019 - 十一月 2019

Reliability Engineering Team
• Learn the product level reliability evaluation for leading-edge silicon process technology on mobile products.
• Learn how to use statistical analysis (Weibull, Lognormal), reliability tools or software, HTOL oven, and ESD machine.

Graduate Research Assistant  •  Taiwan Semiconductor Manufacturing Company (TSMC)

九月 2017 - 九月 2019

TSMC Research Center in NCTU (交大-台積電聯合研發中心)
• Under the supervision of Prof. Chenming Hu, former CTO of TSMC, from UC Berkeley.
• Collaborated with TSRI and NCTU-UCB Joint Center for Intelligent Semiconductor Technology to develop a novel process for next-generation Monolithic 3D BEOL FinFET.

Research Intern  •  Industrial Technology Research Institute (ITRI)

五月 2018 - 四月 2019

Electronics and Optoelectronic System Research Laboratories
• Used different materials as passivation layers to investigate low-temperature Cu-to-Cu bonding techniques.
• Utilized ANSYS APDL to analyze transient thermal conduction problems in different models and boundary conditions.

Undergraduate Research Assistant  •  The Chinese University of Hong Kong (CUHK)

七月 2017 - 八月 2017

Department of Chemistry
• Research topic: Synthesis of Sonogashira Cross-Coupling Reaction.
• Used Pd catalyst to synthesize over 20+ types of compounds to investigate the Sonogashira coupling mechanism.

Summer Intern  •  Academia Sinica

七月 2016 - 九月 2016

Institute of Chemistry
• Research topic: The Conductivity Shift of PEDOT Derivatives.
• Used four-point probe measurement and Autolab to analyze the conductivity of 10+ kinds of conducting polymer.


2020 - 2020

Katholieke Universiteit Leuven

Faculty of Science

2017 - 2020

National Chiao Tung University

International College of Semiconductor Technology

2013 - 2017

National Tsing Hua University

Department of Materials Science and Engineering



  • IC/Semiconductor Engineering
  • Advanced Electronic Packaging
  • 5G/B5G Telecom Technology
  • Radio Access Networks (RAN)

Soft Skills

  • Product Management/Pre-sales
  • Project Management/Service Delivery
  • Account Management/Sales


  • Chinese
  • English
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