洪維澤 (Philip Hung)
Mail : [email protected] / Tel : +(886)-916-277-255
F., No. 28, Daye N. Rd., West Dist., Taichung City 403, Taiwan (R.O.C.)
My name is Philip. I have 3 years consumer production mechanical and thermal engineer experience. Was responsible for thermal design judgement and implement solution in early product stage.
In addition, having 3 years experience as a semiconductor equipment engineer at TSMC strengthens my ability to adapt intense work environment. As a member of lithography process (EUV) department, solving issues for wafer manufacturing timely and precisely improves my professional and communicative skills.
Semiconductor Manufacture (TSMC)
Equipment
- ASML EUV 3400B/3400C
- Tool maintain
- Metrology tool setup
- Defect control
Project
- Join R&D EUV tooling development
- F15B wafer production(N7+)
- Mask defect improving
- HVM fab savety (6S) control
- New employee orientation
Achievement
- N7+ production on EUV
- Reduce 25% mask defect
- The most safety department of
factory
Mechanical and Thermal design (Ability Enterprise)
Production
- Security camera
- Consumer camera
- Sport/wearing camera
Skill
- Mechanical design
- Thermal design and simulation
- CAD/CAM software
PTC-creo/COMSOL/Solidworks
Customer
- Huawei
- Sony
- Fujifilm
