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Co-work with ASIC design team for any architecture discussion, trouble shooting, and performance enhancement Create and maintain ASIC verification test code, SoC bring up System power consumption analysis and design Design and maintain API interface in SDK Occasionally schematic review for PCB design Develop turnkey solution by customer request

The major fields to work include: Cook the demos for benchmarking on Andes CPUs Toolchain performance and code size benchmarking and competitive analysis Comprehensive benchmarks automation, comparison, performance bottleneck and competitive analysis on Andes CPUs Toolchain code size and performance tuning, analysis, benchmark automation and comparison with RISC-V/ARM architecture Linux system performance tuning, analysis, benchmark automation and comparison with RISC-V/ARM architecture Embedded

Monitoring and reporting treasury activities, including derivatives transactions and cash investments to ensure compliance with internal guidelines. Assisting in review of market and credit risk limits setting. Supporting trade confirmation with financial counterparties for treasury activities. Conducting quantitative research for the purpose of market and credit risk analysis. Coordinating with system enhancement projects and initiatives for digital transformation.

1. Analog & Digital Circuits Design 2. Mixed signal & High speed digital design 3. System Integration 4. Audio circuit design & Analysis 5. AC/DC,DC/DC power design

*Note: Applicants are requested to click through Apply Now, register one account on Richemont Official Website, and submit internship applications. Only one account needed to submit multiple brand vacancies. FP&A -Budgeting and Forecasting: Assist brand controllers to complete the system input for budget / rolling forecast cycles -Variance Analysis: Help brand controllers to refresh expense reports for monitoring year-to-date financial performance against budgets and forecasts and explaining any

Data Organization and Analysis - Analyze the product logs and propose suggestions for product optimization. - Collect, generate, and clean data, such as finding relevant articles for specific topics and creating relevant questions. Prompting - Utilize generative AI to expedite the work process. - Develop prompts to generate data at a large scale. System Testing and Evaluation - Ensure the performance of in-house generative AI models. - Compare the performance of various language models, such as

This internship shall last at least 4 months at full-time or 2-4 days per week part-time. Please make sure you will be able to complete this period before sending your application. * Studying and developing RTL code using Verilog to accelerate kernels for Big Data platforms * System debug & Validation of FPGA prototype systems * Performance analysis and tuning of workloads on heterogeneous platform

1. Hardware system block diagram and board schematic design. 2. Define and check layout placement and rule. 3. Hardware platform debugging, investigation, maintenance, alternative components survey , and failure analysis. 4. Support PM/ME/SW/FW/CE/SV/TE/QA/Marketing/Sales/Customer maintenance and documentation created for all projects needed.

1. 3D CAD drawing for mechanical design. 2. Hands on system assembly and prototyping. 3. Familiar with material selection, surface treatment methods, fabrication process and manufacturing outsourcing. 4. Hardware Debugging and issue analysis. 5. Product validation and efficiency optimization. 6. To review, record, document and maintain the design history and BOMs. 7. Technical support along with cross functional team.

Google welcomes people with disabilities. Minimum qualifications: Bachelor's degree in Mechanical Engineering or equivalent practical experience. 5 years of experience in design, analysis, and structure analysis. Experience with FEA (Finite Element Analysis) software. Preferred qualifications: Experience with system design and shipping consumer electronic products (e.g., handheld, mobile consumer electronics devices). Experience in failure modeling of different classes of materials, adhesive, ru