Hsinchu City, Taiwan 300
Devoting to the process improving, yield-enhancing, new equipment function development, relevant testing verification, processing data organization, Process deviant analysis, Preventive mechanism establishment. Also, cooperating with other departments to improve the designation of the manufacturing process.
1. Responsible for special Etching processes yield improvement for 10%.
2. Developing auto Swap wafer functions increases production yield by 12%.
3. Defect analysis and reduction.
4. Teamwork with vendors to do new function testing and data collection.
5. Using Fault Detection & Classification System do the troubleshooting.
6. Tool parameter category and management and also use them as a Preventive mechanism
7. Tool retrofit and software upgrade data validation and function testing.
8. Recipe modification and tool production sequence research
Master Degree (2016-2018)
Bachelor's Degree (2012-2016)
1. Data collection and image analysis
2. Dismantling all the wafer transfer routes
3. Manual run wafer and stimulation to find any possibility
4. Tool robot retrofit from clamp-type to vacuum-type
5. Defect reduce 20% and increase production yield
1. Project coordinator and scheduling arrangement
2. Production yield and wafer amount calculate
3. Co-work with IT teams and Manufacturing teams and Process teams
4. On-site testing and verification
1. Phenomenon observer and model analysis
2. Tool retrofit and transfer cycling testing
3. Data collection and critical dimension experience
4. Wafer Backside defect improvement by 10%
1. Basic disassemble process
2. Analysis of film materials and inner interaction
3. Data and image collection and recording
4. Log analysis and find process weak point
5. Tool Parts correlation with Particle performance
6. Process sequence and recipe study and modify
1. Equipment installment and design
2. Data collection and analysis
3. Heat pipe simulation and retrofit
4. Finding the weak point of the Water Heater
1. Research on Sound Control and coding
2. Mechanism Design and material finger motion analysis
3. All system integration and reification