Upoj51brp2e8z65rtdve

Wun-Shan Jhou

Passionate about the optoelectronics semiconductor industry & enthusiast of automotive

 

Tainan City,TW

0988-157-922

[email protected]


Education

Kun Shan University, Master's degree,

Graduate School of Electro-Optical Engineering, 2014 ~ 2016

Graduating  in the honor of the top-rated prize.(14.29%)

Kun Shan University, Bachelors' degree

Department of Electro-Optical Engineering, 2010 ~ 2014

Graduating in the honor of the third best grading prize.(5.88%)

Work Experience

EPISTAR, R&D, April 2020 ~ October 2020


  • Mini LED project
  1. New Product Introduction and managing the transition to mass production.
  2. Sample presentation to meet customer require.
  3. Cross-functional communication.
    • Set new parameters with engineering department.
    • The manufacturing department assists in improving production capacity.
    • Make a new part number and spec for custom product.
    • Brightness verification for custom product with new process.
    • Production planning.
    • Custom Sorting & Binning Spec.
  • Process improvement and development
  1. Fine tune ITO process parameters, to improve film characteristic for better etch resistance .
  2. Improvement of wafer dicing process parameters for new process/product.
  3. Assist ICP PE to improvement etching process
  • Compose Excel pivot reports to instantly get information about each project

Genesis Photonics, Process Engineer, Nov 2017 ~ March 2020

Process engineers, including process monitoring through the S.P.C. system, abnormal product determination and root cause analysis, revision of relevant process S.O.P. and O.C.A.P. ,assistance in auditing information, etc.


  • Lithography Process Engineer

  1. Monitor the yield of reticle and products through AOI, to improve appearance yield of product.
  2. Making data analysis report of lithography process to optimize parameters to reduce the cost of rework.
  3. Collaborated with cross-department coworkers to develop stepper parameters for specific products.
  4. Reduce the amount of photoresist for operation up to 40% without affecting process stability, reducing cost of photoresist material effectively.
  5. Evaluation of introduction of photoresist, which is expected to reduce cost of photoresist materials with second source.
  • Inductively Coupled Plasma Etching Engineer

  1. Reduce miss operation of operator and facilitate management by integrating process parameters.
  2. Evaluate the feasibility of rework SiC susceptor and reduce the expenditure on new purchases.
  3. Making data analysis report of ICP process, fine tune parameters of etching recipes by analyzing the operation data to improve the process accuracy.
  4. Improve precision of process through paper discussion and patents, SPC has been greatly improved.
  • Others

  1. The Inline AOI system inducts the production to monitor each process station to improve the appearance yield.

NEW IDEAS opto-Electronics, Operator, Jun 2014 ~ Sep 2014

Assembling LED lighting modules and reliability testing

Coretronic, Quality Control Operator, Jun 2013 ~ Sep 2013

Detection of LED TVs

Experience

Teaching Assistant, Sep 2012 ~ Jun 2015

Participated in the "Rewarding university teaching excellence programs", which implemented by the Ministry of Education Republic of China (Taiwan), as a teaching assistant and has been awarded the "Golden Award" for many times during college and Graduate school.

Universal Motorcycle Daytime Running Lamp - Picture 1 & Picture 2 & Video, 2014

Research confirms that the using of daytime running lights (DRL) can significantly reduce car accidents and improve driving safety. This project participates in the industry-university cooperation plan, design specifications in accordance with traffic laws, and participate in the "LED lamp development trend and design and technology introduction of thermal modules" of the Industrial Technology Research Institute. The final product running smoothly.

Special competition of research project of Department of Electro-Optical Engineering, Kun Shan University, 6th place

Papers

Analysis of LED heat dissipation technology and research with ceramic substrate manufacturers and lighting manufacturers, as follows:


Thermal Analysis of Multichip COB LED with Different Color Temperature, Nov 2015

Posted on International Electron Devices & Materials Symposium, Nov 2015

Through the previous motorcycle DRL project, follow-up research the dual color temperature of the automotive headlights, and participate in the OSRAM TAIWAN SSL Customer Day and OSRAM LED automotive lighting technology seminar to understand the development obstacle of Industry.

Due to headlights with high color temperature provides high visibility at night, and headlights with low color temperature can increase driving safety in rainy days and fog, and the automotive LED has a heat issue, I decided to study this project.

Both results of experiment and simulation are matched, and the maximum surface temperature of the packaged LEDs operated at 7 W and 12 W is decreased as the CCT is increased. The conversion efficiency of phosphor for the packaged LEDs with the CCT 5700K is higher than that of 3000K. This model can provide guidance in thermal analysis of LED producer to design different CCT and input power of LEDs.

Effect of Ceramic Substrate Thickness in LED Module on Thermal Characteristic, Mar 2016

Evaluating the effect of changing the thickness of alumina ceramic substrate on the thermal characteristics of LED modules through the development of the Comsol application, ceramic substrate suppliers can simplify the time and labor costs of thermal analysis of LED modules with this module.

When the thickness of the ceramic substrate is reduced, the surface temperature of the COB LED module is lowered. Because the thermal resistance of the ceramic substrate is reduced, the heat transfer path is shortened, and the heat generated by the LED can be quickly transferred to the heat sink, so that it has better thermal characteristics.

Geometric Design APP of Heat Sink, May 2016

High-power LED module heat dissipation has become a significant feature. By developing a heat sink geometry design APP to explore the effect of changing the geometry of the heat sink on the heat dissipation characteristics, the heat sink manufacturer can also use this application to significantly shorten the time and labor cost of thermal analysis.

Posted on Conference on innovation and technology in electronics, signal and communication, May 2016


Skills & License


Software

COMSOL Multiphysics、Microsoft Excel、Word、PowerPoint、Visio、SketchUp、OriginLab、Google Drive


Skill

Improve LED Process Stability, LED Material Evaluation, LED Reliability Verification, LED Thermal Characteristics Analysis, Process Cost Control, Fault Analysis



Language

Chinese ★★★★★

English ★★★☆☆


LED License

Professional LED Engineer-Entry Level (L-B-463-2013)



Electrical License

Industrial Wiring-Class C

(013-073643)

Commercial Wiring-Class C

(007-102956)

Computer Software Application-Class C

(118-618008)


Language License

GENERAL ENGLISH PROFICIENCY TEST-Elementary (E381803)
Powered by CakeResumePowered by CakeResume