Shiuan-Li Lin (林軒立)

7 years of experiences in advanced node OPC & lithography , with excellent skills for EUV/DUV lithography of mask data process & teamwork organization . Extreme familiarity with related EDA tools & OPC Lithography related skills , able to develop for leading-node OPC techniques. 

Work Experiences

Project leader engineer  •  TSMC

Aug 2020 - now

Role of leader with advanced node OPC developing , data process tuning , optical simulation & modeling , key solution provider for physical resolution extreme-limited dimension with challenge lithography layout , successful with advanced node OPC from R&D stage to production line . 

R&D OPC engineer  •  TSMC

Jul 2019 - Aug 2020

Early Research in field with EUV lithography tech. , optical simulation & modeling for EUV physical resolution extreme-limited dimension layout , teamwork organization of related groups and successful build with first advanced node EUV-OPC : state-of-art with EUV litho-processing .   

Seiner engineer  •  TSMC

Sep 2014 - Jul 2019

Focus on production maintenance and trouble-shooting , study of cost-reduction in data process flow and keep high-quality , speed-up data flow . benefit of 30%/year cost in advanced node & mature node mask data processing .   

Education

Sep 2011 - Jun 2013

National Taiwan University

master degree of Photonics and optoelectronic

Sep 2007 - Jun 2011

National Cheng Kung University

bachelor degree of Photonics and optoelectronic

Skill

Language


  • Data Science & Data analysis
  • OPC , EDA related tools 
  • Python , C++ , Perl
  • Mask data process

  • Chinese - Native
  • English - Professional
Powered by CakeResumePowered by CakeResume