⚫ Participating NPI productions: Force touch/CGS/Face ID (iPhone), 3D lamination projects implement successfully (6 cases); Development productions: new dispensing / cooling module on DOE design. ⚫ Clarify issues by process or material, like sensor BP crack, ACF bonding fail…etc., more advanced FACA. ⚫ Cross-department cooperation with NPI/PE/EM/IQC/PM/PD/CAE team. For example, we found out OCA CTE factor is the key causing glue de-lam issue during TC test with CAE team. ⚫ Material testing method establishment for IQC/process, like peeling force, curing rate, viscosity SOP built. ⚫ As an assistant manager, hiring and leading crews to solve issues from internal/external requests and training basic skills in parallel. Besides, leading my crews won the third prize of the 2020 CIP(DFSS) competition. ⚫ Business travels: Align peeling SOP with SDV in Vietnam (2018); 3 ways discussing with vendor/customer about dispensing status in Shenzhen (2020); Face ID product issue solving in Shenzhen (2018). ⚫ Patents innovation: pass rate 64% (Total 14 patents). ⚫ Regular phase report to high level supervisor, CTO and customer.

⚫ Importing IC/wafer product testing from customers with insiders ⚫ Process related works : Testers, socket, programming qualifications.etc., to make sure schedule on time ⚫ Issues analysis from concerned data and further tracking ⚫ As customers contact window for emergency ENG requirements

⚫ Polycrystalline silicon solar cell process defects F/R and improving yield ⚫ Optimized process parameters to enhance photoelectric conversion efficiency ⚫ Raw material verification ⚫ Solved online process emergencies