Bruce Hsieh
Package design and substrate planning manager
v Master of material science technology
v 10 years experience in assembly industry, including
- 3 years wire bonding process experience for lead frame base product
- 6.5 years package design experience for NAND flash product with wire bonding and flip chip product. Package type include BGA base product (MCP / PoP )
- 0.5 year substrate planning experience
v Key achievement
- Focal team leader to achieve major customer annual audit successfully
- Manage new product development from design till mass production
- Leading team to accomplish customer annual project with cross function team
v Phone no. :
0972-393331
v e-mail :
[email protected]
NXP Semiconductors Taiwan Ltd. 台灣恩智浦半導體股份有限公司
National Taiwan University of Science and Technology
Hsinchu, 新竹市台灣
专业背景
- 目前状态
- 专业其他
- 产业制造
- 工作年资10 到 15 年 (10 到 15 年相关工作经验)
- 管理经历我有管理 5～10 人的经验
- 技能
- 语言能力English・中阶
- 最高学历硕士
求职偏好
- 预期工作模式全职・对远端工作有兴趣
- 希望获得的职位Substrate material planning manager
- 期望的工作地点
- 接案服务不提供接案服务
工作经验
Principal Engineer
As a project leader for new product or new technology or new material development. The role need to work with internal cross function team, business unit, quality and engineering team for project development. While development need,
1. from assembly process, package design, selected material point of view to create risk assessment
2. prepare development proposal including development schedule to meet production plan.
3. work with OSAT or production line to complete process window study to make sure qualification quality
Substrate material planning manager
1. Leading 6 members team for substrate planning
2. Work with procurement to define long term substrate allocation and strategy
3. Inventory and excess material control
4. Be coordinator to work with x function team to come out disposition for substrate incoming issue
R&D manager
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate deign
R&D section manager
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate design
R&D senior engineer
1. Project management :
1-1 New product development from design till mass production
1-2 Cost reduction project
2. Trouble shooting, define design rule and upgrade regularly
3. New direct material development (wire /compound / solder ball / die attach film)
Wire bond process engineer
1. Wire bonding process engineer main job function
1-1 new product process condition and loop setting
1-2 New Cu wire and capillary development
1-2 trouble shooting while new product development
2. Focal team leader for new device qualification
3. Mass production trouble shooting and throughput enhancement
学历
Master’s Degree
・
Material Science and TechnologyBachelor’s Degree
・
Material Science and Technology