Bruce Hsieh
Package design and substrate planning manager
v Master of material science technology
v 10 years experience in assembly industry, including
- 3 years wire bonding process experience for lead frame base product
- 6.5 years package design experience for NAND flash product with wire bonding and flip chip product. Package type include BGA base product (MCP / PoP )
- 0.5 year substrate planning experience
v Key achievement
- Focal team leader to achieve major customer annual audit successfully
- Manage new product development from design till mass production
- Leading team to accomplish customer annual project with cross function team
v Phone no. :
0972-393331
v e-mail :
[email protected]
Powertech Technology Inc.
National Taiwan University of Science and Technology
Hsinchu, Hsinchu City, Taiwan
Professional Background
Current status
-
Profession
Other
Fields
Manufacturing
Work experience
10-15 years (10-15 years relevant)
Management
I've had experience in managing 5-10 people
Skills
WordExcel
Languages
English・Intermediate
Highest level of education
Master
Job search preferences
Desired job type
Full time・Interested in working remotely
Desired positions
Substrate material planning manager
Desired work locations
-
Freelance
Non-freelancer
Work Experience
Substrate material planning manager
June 2021 - Present1 yr1 mo
1. Leading 6 members team for substrate planning 2. Work with procurement to define long term substrate allocation and strategy 3. Inventory and excess material control 4. Be coordinator to work with x function team to come out disposition for substrate incoming issueR&D manager
April 2019 - June 20212 yrs3 mos
1. Leading 6 members for new production development 1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base) 1-2 find out best direct material solution through technical discussion and simulation 2. Build up design data base to consolidate capability of team members 3. Coordinator for cross function team project, e.g. standardization substrate deignR&D section manager
June 2016 - April 20192 yrs11 mos
1. Leading 6 members for new production development 1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base) 1-2 find out best direct material solution through technical discussion and simulation 2. Build up design data base to consolidate capability of team members 3. Coordinator for cross function team project, e.g. standardization substrate designR&D senior engineer
June 2014 - June 20162 yrs1 mo
1. Project management : 1-1 New product development from design till mass production 1-2 Cost reduction project 2. Trouble shooting, define design rule and upgrade regularly 3. New direct material development (wire /compound / solder ball / die attach film)Wire bond process engineer
September 2010 - June 20143 yrs10 mos
1. Wire bonding process engineer main job function 1-1 new product process condition and loop setting 1-2 New Cu wire and capillary development 1-2 trouble shooting while new product development 2. Focal team leader for new device qualification 3. Mass production trouble shooting and throughput enhancement
Education
National Taiwan University of Science and Technology
Master’s Degree・Material Science and Technology
2007 - 2009
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