1. IC sorting: DRAM IC test to confirm the special timing of IC to solve complex application problems in engineering.
2. FA: Solve system application problems encountered by customers, and solve compatibility problems.
3. Supplier management: All supplier product verification, specification confirmation. BOM table creation.
4. Presale, introduce the Roadmap to the customer, and share the memory market conditions.
5. Visit Chipset and MB vendors to get the new roadmap and compile the product roadmap.