Responsibility: 1. Collect, divide, and conquer EV market trends, demands and business opportunities. 2. Develop EV business strategy and plan for different regions and customers. 3. Define, maintain, and ensure EV project management standards and assist BG/BU to phase in new business and solution. 4. Plan and execute HHTD event for annual technology exhibition. Achievement: 1. EV business strategy, operation, revenue model planning. 2. Customer engagement, contract negotiation and project management. 3. MIH Open EV Alliance initialization and definition. 4. Tech Day event planning and execution. 5. EV metaverse intrapreneurship for on-line car showroom and shopping.

Title: Director (CTO Office / SSG BU, New technology and product development) Supervisor title: CTO / BU Head Responsibility: 1. Product business strategy and innovative technology planning. 2. Automotive ADAS HW/SW system architecture design, implementation and verification. 3. Surveillance HW/SW system architecture design, implementation and testing. 4. Assist project team (BU) to phase in new solution. 5. Define strategy to enhance product quality. Achievement: 1. Automotive ADAS product strategy, system architecture, prototype design and development. 2. Surveillance product strategy, system architecture, prototype design and testing. 3. Deep Learning Model training and inference development for obstacle detection via Camera. 4. AI camera and Radar sensor fusion.

Title: Tech. Manager (DTP, System and Chipset Development Solution Division, Embedded System Platform Team) Supervisor title: Department Manager Responsibility: 1. Mobile SoC platform and system architecture design, implementation and verification. 2. New area (Mobile, IoT, AR/VR, Automotive, HPC) platform architecture study for performance analysis, optimization and KPI definition. 3. IC design APR implementation. 4. 2.5D/3D IC (Info and CoWoS) implementation. Achievement: 1. Smart glass prototype design and development. 2. 2.5D/3D IC package implementation. 3. 7nm Test Chip APR (Automatic Placement and Routing).

1. Dec. 2008 ~ Feb. 2016 Title: Sr. Tech. Manager (~2016/02, New Technology, Core Team Leader) Manager (~2014/09, New Technology, Core Team Leader) Assistant Manager (~2013/11, New Technology, Core Team Leader) Supervisor title: VP Responsibility: 1. CPU platform architecture study include AP, CP, GPU, Sub-Microprocessor, DSP, I/O, Bus and evaluation to propose proper solution to concept study and project teams. 2. New platform architecture performance analysis, optimization and KPI definition for CPU, GPU, memory, power (DoU & Thermal), display and camera. 3. Custom solutions for HTC innovative technology planning and company strategy. 4. Make market competition analysis with technical perspective and quarterly technical roadmap for project teams. 5. Create and verify new CPU EVM and Prototype to shorten project development schedule and enhance testing process Achievement: Support project team for product plan, early development and fix issues. 2. Aug. 2005 ~ Nov. 2008 Title: Pr. Engineer (~2008/11, Solution and Support team leader) Sr. Engineer (~2006/04, Solution and Support team leader) Supervisor title: Manager Responsibility: 1. New chipset study, design and function verification (CPU, Programming IC, USB, TV-OUT…etc). 2. Customer requirement (Verizon, AT&T…etc) checking for project design and strategy. 3. Project initiation, design document preparation and issues tracking to feedback project design. 4. Firmware/Software coding (CPLD, FPGA, Micro-Processor) to follow project plan. 5. HTC own and customized accessory design (HTC Extend mini-USB/Micro-USB, Normal/HTC/BT/FM Earphone, Cradle, USB/Debug/Video-OUT Cable design...etc.) Achievement: Support project team for early development and fix issues. 3. Aug. 2003 ~ Jul. 2005 Title: Engineer (Project Logic Design team member) Supervisor title: Pr. Engineer Responsibility: 1. Project design, debug and maintain till MP. 2. CPLD coding and to meet project design. Achievement: Dopod 818, Dopod 818 Pro.