My first job after graduation was at Yongjia Technology. I was responsible for the maintenance of the back-end packaging equipment including LSM, LSC, CMF, and INK. Later, in order to know more about the entire packaging process, I transferred to the front-end WireBond station to be responsible for new products. Introduced verification, and participated in the company's silver alloy wire process project, and then entered Donglin Precision, also responsible for the repair, maintenance, troubleshooting, machine modification, and improvement of equipment process capabilities of WB machine equipment, in addition to machine maintenance and abnormal production conditions Excluded, and is also responsible for the repair and maintenance of other special types of equipment at the WB station, including plasma cleaning machine (PLM), placement machine (ATAP), glue dispenser (ADISP)...etc. One of the main tasks of a WB station equipment engineer. Then he entered Licheng Technology as a back-end packaging equipment engineer, responsible for the four stations of the back-end production machines BM, OS, AVI, and OS6.