Failure Analysis (FA) Team, Quality Assurance Dept. Collaborate with quality, manufacturing and design teams, provide guidance on failure modes. Experience of destructive and non-destructive FA techniques: - Mechanical x-section and ion milling, IC delayer and decap - X-ray, SEM/EDX, OM, SAT - Equipment maintenance Reliability Team, Quality Control Dept. Experience of reliability analysis: - High-temperature operating life (HTOL) - Moisture Sensitivity Level (MSL) - Temperature Humidity Bias (THB) and High Accelerated Stress Test (HAST) - Solderability - Ball Shear and Wire Pull test Final Quality Control (FQC), Quality Control Dept. Aggregate production yield report, import VBA program automation. Experience of production shipment verification: - Design program of Vision Measuring System (OGP, Nikon) - Design program and adjust parameters of Wire Bonding machine (ASM) Calibration Laboratory - Electrical instruments calibration - Calibration technical consultation - Lab management, equipment maintenance