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黃奇焜
軟韌體開發工程師
我是黃奇焜，目前任職於IC design house，擔任韌體工程師。
主要的工作範疇有：
1. 晶片的韌體開發及維護
2. 晶片的IP功能驗證
3. SDK開發及維護
領域的相關知識有：
1. 多媒體接收端晶片的韌體開發
2. 影像及聲音壓縮相關演算法及效能調教
3. 數位電視使用之傳輸流 (MPEG-TS)以及調變 (Modulator)
4. USB、SPI、I2C等硬體傳輸介面的韌體開發
5. OpenRISC架構的CPU使用相關經驗
瞻誠科技股份有限公司
高雄科技大學
Hsinchu, 台灣
Professional Background
- Current statusEmployed
- ProfessionEmbedded Developer・Firmware Engineering・System Architecture
- FieldsConsumer Electronics・Semiconductor
- Work experience2-4 years (2-4 years relevant)
- ManagementNone
- Skills
- LanguagesChinese・Native or BilingualEnglish・Beginner
- Highest level of educationMaster
Job search preferences
- Desired job typeFull-time・Interested in working remotely
- Desired positionsFirmware Engineer
- Desired work locationsHsinchu County, Taiwan
- FreelanceNon-freelancer
Work Experience
軟韌體開發工程師
Zhubei, Zhubei City, Hsinchu County, Taiwan 302
我目前負責的工作主要有幾個大項：
1. SDK架構設計及功能開發
2. 晶片功能開發及維護
3. 韌體開發環境建置及維護
4. 晶片規格規劃及功能驗證