Master of Science (MS)・
Master of Mechanical Engineering 2020 - 2022
Description
Research Direction: IC Packaging, FOWLP(Fan-out wafer level package),Wafer warpage, Process emulation
1. Established the semi-analytical model as the quick and effective evaluation to predict warpage and onset bifurcation temperature in FOWLP.
2. Developed equivalence bi-layer structural simplified FE model for predicting wafer warpage,comparing with standard reference which can reduce more than 60% computational cost with just 5% error.
3. Planned the DOE (Design of Experiment) of specimen to verify the accuracy of FEM and semi-analytical models.
4. Designed the processes emulator considering packaging materials characteristics to emulate the process flow for both chip-first and chip-last process.
5. Developed the optimization flow for evaluating appropriate parameters of FOWLP in early design stage of product.