Product Engineer, Assembly Customer Support Engineer, R&D
6 years extensive experience in product engineering, including Tier-1 customer product yield/ volume ramp-up and development in 8 inch Fab (tsmc).
2 years experience on CSP laminate product series from Memory IC assembly house. Including 1.5 years R&D on Tier-1 customer New Product Introduction to mass production. Half year in customer support engineer involve monitor and control from assembly, FT, burn in process to final end customers. (Walton)
Walton Advanced Engineering, Inc., Customer Support Engineer,
Oct 2018 ~ Aug 2019
- Coordinate with NPI team & stage sponsors to ensure product quality, cost, delivery in tier-1 customer service. Including qualification by specific purpose at different product application requirement, process line capacity arrangement and 2nd source material qualification. Also monitor process robustness during developing period and lead to high volume mass production.
-Coordinate with process team to improve product performance and RMA issues.
Including gross marginal improvement, and qualification waiver request determination.
Tier-1 customer LPDDRx DRAM package related new product introduction.
-New package structure and material design/ Warpage and AVI performance analysis and release to mass production. Also support eturn-key service from IC packaging, final test, burn in for finished goods to drop shipment for end customer.
TSMC, Senior Product Engineer, Aug 2009 ~ Sep 2015
Extensive experience in tier-1 customer and high volume(>30K/month) product yield ramp-up and development engineer in 8 inch Fab and special product function about RF, Logic, Mixed mode, Hybrid and SOI, Fingerprint sensor and IPD (Passive device) technologies in backend AlCu/Cu tech foundries.
-Process window and product performance improvement by datalog statistical and on-tester analysis.
-Product development and characterization which involves pre design rule check and test program robustness to qualify customer’s new product.
-Work with customer’s design and testing team to debug the failed circuits and give proper direction to physical failure analysis team and create failure model through simulating the process variations.
-Coordinate inter Fab product transfer support by analyzing and matching the key parameters.
National Central University, Master Degree, Electrical Engineering,