楊尚憲 (Sam Yang)

9 years of experience in packaging process improvement and NPI product introduction. With integrated thinking and cross-departmental integration capabilities.

苗栗市竹南鎮大埔街119號2樓-3        Mobile: 0921244313       Mail: [email protected]

Job history

Senior Engineer  •  ASE-Chung Li (Technology Center

Oct 2015 - Nov 2020

FCB line and Dispensing process and equipment evaluation , cross depart automation project owner  

  1. With team work success import CMC G-MEMS products to mass production.
  2. FCB line NPI evaluation and improvement (FCBGA/FCQFN/HSFCQFN/HSFCBGA)
  3. Import acid clean process reduce cold join defect to improve FCB process yield.
  4. RMS parameter auto setup and change control system build up (All major process step).
  5. Auto factory KPI report build up (MTBA/MTBF/CO/DT/OEE/COEE)   

Process Develop Engineer  • Aptos Technology 

Sep 2011 - Oct 2015

Assembly Back-End and WLCSP Back-End process develop and improve.

  1. Finger Printer (SIP) success import product to mass production.(DLC coating / clean process develop)
  2. Successes to improved backside protection products low yield status.
  3. Solve marking break and wafer saw chipping by DOE experiment with Backside metal water.
  4. Fan-out process development assistance.

Litho Process Engineer  •  Rex Chip (now Micro Technology)

 Aug 2010 - Sep 2011

The manufacture processing management by daily reviewing and yield improvement

  1. DRAM photo process developing and equipment handling. (I-layer)

  2. For the new product development and the production of the photo reticle assessment and review.

  3. Litho entity process parameters modified to improve the utilization rate and reduce the loss of material produced. (Cost down plan and entity up-time improved)

Education


Apr 2004 - Jan 2009

ISU University 

Material Engineer and Science

Apr 2001 - Jan 2004

Chang Jung Senior High School

High school

技能

語言


  • Auto Cad/Solid Work
  • 6sigma green belt
  • JMP, SAS-EG

  • Chinese
  • English 
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