Taipei, Taiwan As the Team Lead and manage with a total of 4 people. 1. Team Formation and Leadership Initiated and led the formation of a new testing team. Provided guidance on planning from business logic documents and led efforts to ensure a comprehensive understanding of business processes. 2. Skill Development and Cross-Team Communication Mentored the team on testing techniques and fostered effective communication across different teams. Ensured a seamless integration process from development to testing to release, emphasizing the importance of minimizing frequent releases. 3. Process Integration Oversaw the entire
Technical Integration and Customer Service Senior Engineer @Hannstar
・
2019 ~ Present
Semiconductor Engineer
Within two months
Chun-Yi Lee, Stanley Well abilities in trouble shooting, cross functional team collaborating, schedule controlling and resource managing; possess proactive, continued learning attitude . Strong expertise in new product introduction, schedule control and design issue fixing, quality or cycle time improvement project, and domestic or oversea customer service. Email : [email protected] Phone :Work Experience • JunP resent, Technical Integration and Customer Service Senior Enginee r • Hannstar display corporation Clarified issues, cross-sectoral cooperation, provided technical solutions and supported worldwide customers for technical service on product quality. Initiated process DOE for product quality issues for Truly & Amazon
Shih Heng Sun Semiconductor Process Integration Engineer with 5+ years of experience. TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives. Work Experiences Yield Improvement Engineer • TSMC Fab12B AugustDecember 2020 Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring
process development Process integration engineer • Taiwan Semiconductor Manufacturing Company(TSMC) JulyApril 2014 Process integration engineer from 20nm to 40nm - 55/65nm - 90nm and other mature technologies 1. Mature technology node: Customer handling (including new tape-out, low yield analysis, WAT, SPC chart) 2. Advanced technology node: 20nm process transfer from Hsinchu to Tainan, and 2P2E-DUV pitch 64nm Cu-interconnect process development EducationNational Yang Ming Chiao Tung University Electrical Engineering & IC designChang Gung University,CGU Electrical Engineering Department Personal advantage Strong learning ability Good at teamwork High problem solving ability Skills Reliability improvement Defect reduction Process Integration
Process Integration Engineer @Taiwan Semiconductor Manufacturing Company
・
2014 ~ Present
Product Engineer
Within one year
and in the company. I hope that I have opportunity to try my best for your company with my extensive experience. Process Integration Engineer, TSMC, Tainan, Taiwan [email protected] Semiconductor (5nm~90nm) Device engineering Semiconductor Process WAT Analysis Yield Analysis Process Quality Test Manufacturing Statistical Process Control (SPC) Cp/Cpk Failure Mode and Effects Analysis (FMEA) Design of Experiments (DOE) PDCA 3-Leg-5-Why 8D Pareto Chart Box Plot & Normal Quantile Plot Failure Analysis Tool JMP software Transmission Electron Microscopy (TEM) Energy-dispersive X-ray spectroscopy (EDX) Work Experience TSMC, Process Integration Engineer
評估製程專案計劃 6.協助佈展並參展FINETECH JAPAN(日本顯示器製造技術展) 7.總攬無接縫圓筒生產線與鎳電鑄製程生產線 Process Engineer Responsibilities: - Seamless NIL technology R&D - Electroforming process control and improvement - Roll to roll production technology - Photo-resist coating process control and improvement - Plate to roller process control and improvement - Process integration Awards and Key Contributions: - Team leader - Process yield rate increase 20% - Execute process project - Improve photoresist