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Definition of Reputation Credits
Bruce Hsieh
Package Innovation Principle Engineer
Hsinchu City, Taiwan
v Master of material science technology
v 10 years experience in assembly industry, including
- 3 years wire bonding process experience for logic product with lead frame base
- 6.5 years package design experience for memory product with wire bonding and flip chip base. Package type include BGA base product (MCP / PoP )
- 0.5 year substrate planning experience
- Work in NXP package innovation as project leader now, to handle new product or new technology development
v Key achievement
- Focal team leader to achieve major customer annual audit successfully
- Manage new product development from design till mass production withhigh hitting rate
- Leading team to accomplish customer annual project with cross function team
* E-mail : [email protected]
* Phone no. : 0972-393331
Working Experience
工作經歷
Principal Engineer
NXP Semiconductors Taiwan Ltd. 台灣恩智浦半導體股份有限公司
Apr. 2022 - Present
HsinChu, Taiwan
As a project leader for new product or new technology or new material development. The role need to work with internal cross function team, business unit, quality and engineering team for project development. While development need,
1. from assembly process, package design, selected material point of view to create risk assessment
2. prepare development proposal including development schedule to meet production plan.
3. work with OSAT or production line to complete process window study to make sure qualification quality
Substrate material planning manager
Powertech Technology Inc.
六月 2021 - Present
HsinChu, Taiwan
1. Leading 6 members team for substrate planning
2. Work with procurement to define long term substrate allocation and strategy
3. Inventory and excess material control
4. Be coordinator to work with x function team to come out disposition for substrate incoming issue
R&D manager
Powertech Technology Inc.
四月 2019 - 六月 2021
HsinChu, Taiwan
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate deign
R&D section manager
Powertech Technology Inc.
六月 2016 - 四月 2019
HsinChu, Taiwan
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate design
R&D senior engineer
Powertech Technology Inc.
六月 2014 - 六月 2016
HsinChu, Taiwan
1. Project management :
1-1 New product development from design till mass production
1-2 Cost reduction project
2. Trouble shooting, define design rule and upgrade regularly
3. New direct material development (wire /compound / solder ball / die attach film)
Wire bond process engineer
SPIL
九月 2010 - 六月 2014
TaiChung, Taiwan
1. Wire bonding process engineer main job function
1-1 new product process condition and loop setting
1-2 New Cu wire and capillary development
1-2 trouble shooting while new product development
2. Focal team leader for new device qualification
3. Mass production trouble shooting and throughput enhancement
Jun. 2021 - Mar. 2022
Substrate material planning manager Powertech Technology Inc.
1. Leading a 6 member team for substrate planning
2. Work with procurement to define long term substrate allocation and strategy
3. Inventory and excess material control. Work with process team to come out a plan to consume excess material
4. Be coordinator to work with a cross-function team to come out disposition for substrate incoming issue
5.Monitor substrate delivery and negotiate with suppliers
Apr. 2019 - Jun. 2021
R&D manager Powertech Technology Inc.
1. Leading 6 members for new production development
1-1 work with customers who has memory foundry to find out the best design solution for new product. (product type including MCP with wire bond and flip chip base)
1-2 find out the best direct material solution through technical discussion and simulation
1-3 work with project managed team to come out product development milestone
2. Build up design data base to consolidate the capability of team members
3. Be a coordinator and communication with cross function team project, e.g. standardization substrate design
4. To communicate and align a working model for better communication with customer manager
5.Integrate suppliers's technical road map with assembly process road map
Jun. 2016 - Apr. 2019
R&D section manager Powertech Technology Inc.
1. Leading 6 members for new production development
1-1 work with customers who has memory foundry to find out the best design solution for new product. (product type including MCP with wire bond and flip chip base)
1-2 find out the best direct material solution through technical discussion and simulation
1-3 work with project manag team to come our product development milestone
2. Build up design data base to consolidate the capability of team members
3. Be a coordinator and communication with cross function team project, e.g. standardization substrate design
4. Communicate with suppliers for new direct material development.
Jun. 2014 - Jun. 2016
R&D senior engineer Powertech Technology Inc.
1. Project management :
1-1 Memory new product development from design till mass production. MCP (NAND+DRAM+controller) and PoP (DRAM) are major package type.
1-2 Cost reduction project
1-3 Work with process engineering team to come out DOE matrix for new structure or new material development
2. Trouble shooting, defining, integrating design rules and upgrading regularly
3. New direct material development (wire /compound / solder ball / die attach film)
Sep. 2010 - Jun. 2014
Wire bond process engineer SPIL
1. Wire bonding process engineer for QFN package, the main job function are,
1-1 New product process condition and loop setting
1-2 New Cu wire and capillary development
1-3 Trouble shooting while new product development
1-4 Mass production trouble shooting and throughput enhancement
2. Focal team leader for new device qualification
3. Work with technical center to build up parameter data base and selection rule
Education
2007 - 2009
National Taiwan University of Science and Technology
Master of Material Science and Technology
2003 - 2007
National United University
Bachelor of Material Science and Technology
Bruce Hsieh
Package Innovation Principle Engineer
Hsinchu City, Taiwan
v Master of material science technology
v 10 years experience in assembly industry, including
- 3 years wire bonding process experience for logic product with lead frame base
- 6.5 years package design experience for memory product with wire bonding and flip chip base. Package type include BGA base product (MCP / PoP )
- 0.5 year substrate planning experience
- Work in NXP package innovation as project leader now, to handle new product or new technology development
v Key achievement
- Focal team leader to achieve major customer annual audit successfully
- Manage new product development from design till mass production withhigh hitting rate
- Leading team to accomplish customer annual project with cross function team
* E-mail : [email protected]
* Phone no. : 0972-393331
Working Experience
工作經歷
Principal Engineer
NXP Semiconductors Taiwan Ltd. 台灣恩智浦半導體股份有限公司
Apr. 2022 - Present
HsinChu, Taiwan
As a project leader for new product or new technology or new material development. The role need to work with internal cross function team, business unit, quality and engineering team for project development. While development need,
1. from assembly process, package design, selected material point of view to create risk assessment
2. prepare development proposal including development schedule to meet production plan.
3. work with OSAT or production line to complete process window study to make sure qualification quality
Substrate material planning manager
Powertech Technology Inc.
六月 2021 - Present
HsinChu, Taiwan
1. Leading 6 members team for substrate planning
2. Work with procurement to define long term substrate allocation and strategy
3. Inventory and excess material control
4. Be coordinator to work with x function team to come out disposition for substrate incoming issue
R&D manager
Powertech Technology Inc.
四月 2019 - 六月 2021
HsinChu, Taiwan
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate deign
R&D section manager
Powertech Technology Inc.
六月 2016 - 四月 2019
HsinChu, Taiwan
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate design
R&D senior engineer
Powertech Technology Inc.
六月 2014 - 六月 2016
HsinChu, Taiwan
1. Project management :
1-1 New product development from design till mass production
1-2 Cost reduction project
2. Trouble shooting, define design rule and upgrade regularly
3. New direct material development (wire /compound / solder ball / die attach film)
Wire bond process engineer
SPIL
九月 2010 - 六月 2014
TaiChung, Taiwan
1. Wire bonding process engineer main job function
1-1 new product process condition and loop setting
1-2 New Cu wire and capillary development
1-2 trouble shooting while new product development
2. Focal team leader for new device qualification
3. Mass production trouble shooting and throughput enhancement
Jun. 2021 - Mar. 2022
Substrate material planning manager Powertech Technology Inc.
1. Leading a 6 member team for substrate planning
2. Work with procurement to define long term substrate allocation and strategy
3. Inventory and excess material control. Work with process team to come out a plan to consume excess material
4. Be coordinator to work with a cross-function team to come out disposition for substrate incoming issue
5.Monitor substrate delivery and negotiate with suppliers
Apr. 2019 - Jun. 2021
R&D manager Powertech Technology Inc.
1. Leading 6 members for new production development
1-1 work with customers who has memory foundry to find out the best design solution for new product. (product type including MCP with wire bond and flip chip base)
1-2 find out the best direct material solution through technical discussion and simulation
1-3 work with project managed team to come out product development milestone
2. Build up design data base to consolidate the capability of team members
3. Be a coordinator and communication with cross function team project, e.g. standardization substrate design
4. To communicate and align a working model for better communication with customer manager
5.Integrate suppliers's technical road map with assembly process road map
Jun. 2016 - Apr. 2019
R&D section manager Powertech Technology Inc.
1. Leading 6 members for new production development
1-1 work with customers who has memory foundry to find out the best design solution for new product. (product type including MCP with wire bond and flip chip base)
1-2 find out the best direct material solution through technical discussion and simulation
1-3 work with project manag team to come our product development milestone
2. Build up design data base to consolidate the capability of team members
3. Be a coordinator and communication with cross function team project, e.g. standardization substrate design
4. Communicate with suppliers for new direct material development.
Jun. 2014 - Jun. 2016
R&D senior engineer Powertech Technology Inc.
1. Project management :
1-1 Memory new product development from design till mass production. MCP (NAND+DRAM+controller) and PoP (DRAM) are major package type.
1-2 Cost reduction project
1-3 Work with process engineering team to come out DOE matrix for new structure or new material development
2. Trouble shooting, defining, integrating design rules and upgrading regularly
3. New direct material development (wire /compound / solder ball / die attach film)
Sep. 2010 - Jun. 2014
Wire bond process engineer SPIL
1. Wire bonding process engineer for QFN package, the main job function are,
1-1 New product process condition and loop setting
1-2 New Cu wire and capillary development
1-3 Trouble shooting while new product development
1-4 Mass production trouble shooting and throughput enhancement
2. Focal team leader for new device qualification
3. Work with technical center to build up parameter data base and selection rule
Education
2007 - 2009
National Taiwan University of Science and Technology
Master of Material Science and Technology
2003 - 2007