resulting in an 86.95% reduction in wafer scrap rate. (Preventive Mechanism) Detection Mechanism for Tilted Plate on Coating Hot Plate. Early Warning System to Prevent Wafer Fragmentation: Sensors are installed at three specific locations on the hot plate to detect fragments. If the Robot Paddle fails to place the wafer precisely on these points, triggering an alarm mechanism, the machine halts operation immediately and automatically dispatches for maintenance, reducing the probability of wafer fragmentation in the hot plate by 80%. (Cost Control) Photoresist Flow Reduction Improvement. To save on photoresist costs, the spraying
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Employed
Full-time / Interested in working remotely
4-6 years
National Cheng Kung University
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工程科學系
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