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Taipei, Taiwan As the Team Lead and manage with a total of 4 people. 1. Team Formation and Leadership Initiated and led the formation of a new testing team. Provided guidance on planning from business logic documents and led efforts to ensure a comprehensive understanding of business processes. 2. Skill Development and Cross-Team Communication Mentored the team on testing techniques and fostered effective communication across different teams. Ensured a seamless integration process from development to testing to release, emphasizing the importance of minimizing frequent releases. 3. Process Integration Oversaw the entire

國立中興大學 2006年 9 月年 6 月 技能 語言能力 中文：精通 英文：精通 溝通技巧 Coaching, motivating and mentoring Public presentation and speaking Easily establishes relationships with vendors 專業技能 Data analyst Process integration Automation systems Capacity Planning 新品開發專案成果 好事多OEM三層抽取式衛生紙 運用壓花加工技術增加厚實感 五月花雪絨柔感二層抽取

Chun-Yi Lee, Stanley Well abilities in trouble shooting, cross functional team collaborating, schedule controlling and resource managing; possess proactive, continued learning attitude . Strong expertise in new product introduction, schedule control and design issue fixing, quality or cycle time improvement project, and domestic or oversea customer service. Email : [email protected] Phone :Work Experience • JunP resent, Technical Integration and Customer Service Senior Enginee r • Hannstar display corporation Clarified issues, cross-sectoral cooperation, provided technical solutions and supported worldwide customers for technical service on product quality. Initiated process DOE for product quality issues for Truly & Amazon

Shih Heng Sun Semiconductor Process Integration Engineer with 5+ years of experience. TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives. Work Experiences Yield Improvement Engineer • TSMC Fab12B AugustDecember 2020 Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring

process development Process integration engineer • Taiwan Semiconductor Manufacturing Company(TSMC) JulyApril 2014 Process integration engineer from 20nm to 40nm - 55/65nm - 90nm and other mature technologies 1. Mature technology node: Customer handling (including new tape-out, low yield analysis, WAT, SPC chart) 2. Advanced technology node: 20nm process transfer from Hsinchu to Tainan, and 2P2E-DUV pitch 64nm Cu-interconnect process development EducationNational Yang Ming Chiao Tung University Electrical Engineering & IC designChang Gung University，CGU Electrical Engineering Department Personal advantage Strong learning ability Good at teamwork High problem solving ability Skills Reliability improvement Defect reduction Process Integration

and in the company. I hope that I have opportunity to try my best for your company with my extensive experience. Process Integration Engineer, TSMC, Tainan, Taiwan [email protected] Semiconductor (5nm~90nm) Device engineering Semiconductor Process WAT Analysis Yield Analysis Process Quality Test Manufacturing Statistical Process Control (SPC) Cp/Cpk Failure Mode and Effects Analysis (FMEA) Design of Experiments (DOE) PDCA 3-Leg-5-Why 8D Pareto Chart Box Plot & Normal Quantile Plot Failure Analysis Tool JMP software Transmission Electron Microscopy (TEM) Energy-dispersive X-ray spectroscopy (EDX) Work Experience TSMC, Process Integration Engineer

評估製程專案計劃 6.協助佈展並參展FINETECH JAPAN（日本顯示器製造技術展） 7.總攬無接縫圓筒生產線與鎳電鑄製程生產線 Process Engineer Responsibilities: - Seamless NIL technology R&D - Electroforming process control and improvement - Roll to roll production technology - Photo-resist coating process control and improvement - Plate to roller process control and improvement - Process integration Awards and Key Contributions: - Team leader - Process yield rate increase 20% - Execute process project - Improve photoresist