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National Taiwan University
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Past
Process Integration Engineer @TSMC Fab12B
2019 ~ 2021
Yield Improvement Engineer
More than one year
Communicating
Measuring Instruments
Semiconductor Process
Unemployed
Full-time / Interested in working remotely
4-6 years
National Taiwan University
M.S. Photonics and Optoelectronics
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Avatar of Marvin Lin.
iOS Developer @CMoney全曜財經資訊股份有限公司
2019 ~ Present
Senior iOS Developer
Within one month
Quiz - https://itunes.apple.com/tw/app/idExperienced with App deployment procedure on App Store. Experienced with Git/Github version control. Had experience of Scrum developing procedure Toshiba, Out sourcing project manager, Nov 2013 ~ Apr 2017 Focusing on back-end process of semiconductor of memory (SSD). Constructed Business Intelligence (BI) system to all out sourcing resource. Introduced BI tool (Spotfire) to weekly, monthly report of all out sourcing resource. Managing schedule and monitoring out-sourcing items process. Monitoring shipment situation of out-sourcing sites. Showa
IOS
Objective-C/Swift
SwiftUI
Reputation Credits2
Employed
Not open to opportunities
Full-time / Interested in working remotely
6-10 years
National Taiwan University
Material Science
Avatar of John Chiu.
Avatar of John Chiu.
Past
AI Project Coordinator @TSMC
2020 ~ Present
雲端工程師,雲端架構師
More than one year
experiencing various cultures is my favourite after work. Graduate Student at the University of Auckland Hsinchu,TW [email protected] Work Experience AI Project Coordinator,, 1 year, 6 months Taiwan Semiconductor Manufacturing Company @ Machine-learning-based DoE (D esign o f E xperiments ) Consult 10+ process recipe tuning projects in advanced technology (N3, N2, N1.4) Build up a machine-learning adoption framework to assist used OFAT to MFAT tuning. Data Scientist, 8 years 3 months Taiwan Semiconductor Manufacturing Company @ Ma chine Learning Solution Development Using OpenCV(C#), ImageJ (Java) and
Word
Google Drive
Excel
Unemployed
Full-time / Interested in working remotely
6-10 years
National Taiwan University
Industrial Engineering
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Project leader engineer(主任工程師) @TSMC
2014 ~ Present
Optical engineer, Semiconductor engineer
Within three months
OPC
Data Science
Python
Employed
Full-time / Interested in working remotely
6-10 years
National Taiwan University
Photonics and optoelectronic
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CTO @KryptoGO Co., Ltd.
2021 ~ Present
AI Software Engineer,Deep learning Engineer
Within one year
Algorithm
ASP.NET
Machine Learning
Employed
Not open to opportunities
Full-time / Interested in working remotely
6-10 years
National Taiwan University
Computer Science and Information Engineering

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More than one year
Yield Improvement Engineer
TSMC Fab12B
2019 ~ 2021
Professional Background
Current status
Unemployed
Job Search Progress
Professions
Electrical Engineer, Product Engineer
Fields of Employment
Consumer Electronics
Work experience
4-6 years
Management
None
Skills
Communicating
Measuring Instruments
Semiconductor Process
Property Analysis
Field Inspection
Data Analysis
Word
PowerPoint
Excel
Languages
English
Fluent
Chinese
Native or Bilingual
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Positions
Yield Improvement Engineer
Job types
Full-time
Locations
Taipei, 台灣, Zhubei, Zhubei City, Hsinchu County, Taiwan
Remote
Interested in working remotely
Freelance
No
Educations
School
National Taiwan University
Major
M.S. Photonics and Optoelectronics
Print

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills


  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages


  • English — Fluent
  • Chinese — Native
Resume
Profile

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills


  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages


  • English — Fluent
  • Chinese — Native