I have over 5-year automotive development and 14-year consumer product experiences from system architecture to mass production.
I am optimistic and open-minded that I enjoy being with people and like to have fun with people around me. And, I can also stay calm and serious when a business is seriously concerned.
I always have my work well planned and then carried it out effectively.
I’d love to play a role of a good assistant.
I can be a winged steed and now I am looking for a real good horse master.
III. Custom IC Implementation
Title: Director (CTO Office / SSG BU, New technology and product development)
Supervisor title: CTO / BU Head
Responsibility:
1. Product business strategy and innovative technology planning.
2. Automotive ADAS HW/SW system architecture design, implementation and verification.
3. Surveillance HW/SW system architecture design, implementation and testing.
4. Assist project team (BU) to phase in new solution.
5. Define strategy to enhance product quality.
Achievement:
1. Automotive ADAS product strategy, system architecture, prototype design and development.
2. Surveillance product strategy, system architecture, prototype design and testing.
3. Deep Learning Model training and inference development for obstacle detection via Camera.
4. AI camera and Radar sensor fusion.
Title: Tech. Manager (DTP, System and Chipset Development Solution Division, Embedded System Platform Team)
Supervisor title: Department Manager
Responsibility:
1. Mobile SoC platform and system architecture design, implementation and verification.
2. New area (Mobile, IoT, AR/VR, Automotive, HPC) platform architecture study for performance analysis, optimization and KPI definition.
3. IC design APR implementation.
4. 2.5D/3D IC (Info and CoWoS) implementation.
Achievement:
1. Smart glass prototype design and development.
2. 2.5D/3D IC package implementation.
3. 7nm Test Chip APR (Automatic Placement and Routing).
1. Dec. 2008 ~ Feb. 2016
Title: Sr. Tech. Manager (~2016/02, New Technology, Core Team Leader) Manager (~2014/09, New Technology, Core Team Leader) Assistant Manager (~2013/11, New Technology, Core Team Leader)
Supervisor title: VP
Responsibility:
1. CPU platform architecture study include AP, CP, GPU, Sub-Microprocessor, DSP, I/O, Bus and evaluation to propose proper solution to concept study and project teams.
2. New platform architecture performance analysis, optimization and KPI definition for CPU, GPU, memory, power (DoU & Thermal), display and camera.
3. Custom solutions for HTC innovative technology planning and company strategy.
4. Make market competition analysis with technical perspective and quarterly technical roadmap for project teams. 5. Create and verify new CPU EVM and Prototype to shorten project development schedule and enhance testing process
Achievement: Support project team for product plan, early development and fix issues.
2. Aug. 2005 ~ Nov. 2008
Title: Pr. Engineer (~2008/11, Solution and Support team leader) Sr. Engineer (~2006/04, Solution and Support team leader)
Supervisor title: Manager
Responsibility:
1. New chipset study, design and function verification (CPU, Programming IC, USB, TV-OUT…etc).
2. Customer requirement (Verizon, AT&T…etc) checking for project design and strategy.
3. Project initiation, design document preparation and issues tracking to feedback project design.
4. Firmware/Software coding (CPLD, FPGA, Micro-Processor) to follow project plan.
5. HTC own and customized accessory design (HTC Extend mini-USB/Micro-USB, Normal/HTC/BT/FM Earphone, Cradle, USB/Debug/Video-OUT Cable design...etc.)
Achievement: Support project team for early development and fix issues.
3. Aug. 2003 ~ Jul. 2005
Title: Engineer (Project Logic Design team member)
Supervisor title: Pr. Engineer
Responsibility:
1. Project design, debug and maintain till MP.
2. CPLD coding and to meet project design.
Achievement: Dopod 818, Dopod 818 Pro.
I have over 5-year automotive development and 14-year consumer product experiences from system architecture to mass production.
I am optimistic and open-minded that I enjoy being with people and like to have fun with people around me. And, I can also stay calm and serious when a business is seriously concerned.
I always have my work well planned and then carried it out effectively.
I’d love to play a role of a good assistant.
I can be a winged steed and now I am looking for a real good horse master.
III. Custom IC Implementation
Title: Director (CTO Office / SSG BU, New technology and product development)
Supervisor title: CTO / BU Head
Responsibility:
1. Product business strategy and innovative technology planning.
2. Automotive ADAS HW/SW system architecture design, implementation and verification.
3. Surveillance HW/SW system architecture design, implementation and testing.
4. Assist project team (BU) to phase in new solution.
5. Define strategy to enhance product quality.
Achievement:
1. Automotive ADAS product strategy, system architecture, prototype design and development.
2. Surveillance product strategy, system architecture, prototype design and testing.
3. Deep Learning Model training and inference development for obstacle detection via Camera.
4. AI camera and Radar sensor fusion.
Title: Tech. Manager (DTP, System and Chipset Development Solution Division, Embedded System Platform Team)
Supervisor title: Department Manager
Responsibility:
1. Mobile SoC platform and system architecture design, implementation and verification.
2. New area (Mobile, IoT, AR/VR, Automotive, HPC) platform architecture study for performance analysis, optimization and KPI definition.
3. IC design APR implementation.
4. 2.5D/3D IC (Info and CoWoS) implementation.
Achievement:
1. Smart glass prototype design and development.
2. 2.5D/3D IC package implementation.
3. 7nm Test Chip APR (Automatic Placement and Routing).
1. Dec. 2008 ~ Feb. 2016
Title: Sr. Tech. Manager (~2016/02, New Technology, Core Team Leader) Manager (~2014/09, New Technology, Core Team Leader) Assistant Manager (~2013/11, New Technology, Core Team Leader)
Supervisor title: VP
Responsibility:
1. CPU platform architecture study include AP, CP, GPU, Sub-Microprocessor, DSP, I/O, Bus and evaluation to propose proper solution to concept study and project teams.
2. New platform architecture performance analysis, optimization and KPI definition for CPU, GPU, memory, power (DoU & Thermal), display and camera.
3. Custom solutions for HTC innovative technology planning and company strategy.
4. Make market competition analysis with technical perspective and quarterly technical roadmap for project teams. 5. Create and verify new CPU EVM and Prototype to shorten project development schedule and enhance testing process
Achievement: Support project team for product plan, early development and fix issues.
2. Aug. 2005 ~ Nov. 2008
Title: Pr. Engineer (~2008/11, Solution and Support team leader) Sr. Engineer (~2006/04, Solution and Support team leader)
Supervisor title: Manager
Responsibility:
1. New chipset study, design and function verification (CPU, Programming IC, USB, TV-OUT…etc).
2. Customer requirement (Verizon, AT&T…etc) checking for project design and strategy.
3. Project initiation, design document preparation and issues tracking to feedback project design.
4. Firmware/Software coding (CPLD, FPGA, Micro-Processor) to follow project plan.
5. HTC own and customized accessory design (HTC Extend mini-USB/Micro-USB, Normal/HTC/BT/FM Earphone, Cradle, USB/Debug/Video-OUT Cable design...etc.)
Achievement: Support project team for early development and fix issues.
3. Aug. 2003 ~ Jul. 2005
Title: Engineer (Project Logic Design team member)
Supervisor title: Pr. Engineer
Responsibility:
1. Project design, debug and maintain till MP.
2. CPLD coding and to meet project design.
Achievement: Dopod 818, Dopod 818 Pro.