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Blair Yu Director of Product Engineering at SV TCL Multi-site and Multi-culture communication and team work experience (countries includes Autria, China, Czech, German, Neitherland, Mexico, USA, Switzerland) Problem solving with solid logic thinking Large team (30+ team members) leading and management People and team development Risk assessment with mitigation plan Team coaching and motivation Specialties: SPC, Statistic Process Control Skill and knowledge FMEA analysis and action plan Hsinchu, Hsinchu City, [email protected] https://www.linkedin.com/in/bert-blair-yu-pmp-89334a20/ 工作經歷 一

@gmail.comSkills Semiconductor (5nm~90nm) Device engineering Semiconductor Process WAT Analysis Yield Analysis Process Quality Test Manufacturing Statistical Process Control (SPC) Cp/Cpk Failure Mode and Effects Analysis (FMEA) Design of Experiments (DOE) PDCA 3-Leg-5-Why 8D Pareto Chart Box Plot & Normal Quantile Plot Failure Analysis Tool JMP software Transmission Electron Microscopy (TEM) Energy-dispersive X-ray spectroscopy (EDX) Work Experience TSMC, Process Integration Engineer Nov 2014 ~ Present 5nm process experience for new product tape-out, yield/device improvement, process optimization and risk assessment. More than moore products' experience including 40/55

sheet metal module. ‐ Validate the layout and module function, establish evaluation plan for testing according to the industry-specific regulations and standards, ensuring designs comply with relevant requirements. ‐ Collect CMF and DFM for tooling open, driving technical knowledge transfer to mass production. ‐ Establish and evaluate the tolerance analysis, statistical analysis for the quality control. ‐ Draft new product development and quotation to customer, ensuring the cost-effectiveness and cost optimization. ‐ Spot the creative mindset to propose and implement innovative solutions to the engineering challenges and then register the new patent, e.g., Paper staging