CakeResume Talent Search

In process control (stability), process capability best practice cross fertilization management. • Promoting yield improvement and systematically feedback information to new product development team, PDCA cycle review. • Actively identify scrap saving opportunities. • Process optimization related to yield loss caused by strict customer requirements and quality case. • Be yield enhancement hub for technical assessment from IC circuit design, wafer manufacturing, assembly, test and OSAT capability evaluation. • Initiate taskforces to drive OSAT on multi-dimensional tasks including customer voice, quality focus, production sustaining. • Lead continuous improvement program to achieve excellent yield and quality performance. • Drive yield

吳明赫 Test Equipment Technician Taichung City, Taiwan Passionate about continuous learning and professional growth, good at working effectively under pressure, with 10 years of experience in semiconductor back-end equipment. Demonstrates excellence in equipment maintenance, upkeep, improvements and capability enhancements. 工作經歷 Test Equipment Technician Micron Technology 台灣美光 • 十一月Present # Leadership Daily *improvement Equipment UPH/PPJ/MTBF/SDT/UDT KPI, until meet target *Mentor other equipment engineers in the respective area *Support edit/improve Equipment...OCAP/Procedure/SOP

Shih Heng Sun Semiconductor Process Integration Engineer with 5+ years of experience. TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives. Work Experiences Yield Improvement Engineer • TSMC Fab12B AugustDecember 2020 Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring

for Hisilicon FCCSP Device * New Product Introduction Planning -Risk Assessment: Substrate design review, process FMEA review, flow definition, BOM material selection and reliability verification -Yield Management: Yield improvement, Customer engineer lot arrangement 2. ATV Project team during 2020/08~2022/03 for ATV system construction - ATV factory enhancement with 5M1E, hand free improvement, and unit traceability with BGA device -ATV NPI device defect gating enhancement -ATV BOM selection recommendation -Support to ATV customer audit (Renesas and Toshiba) 3. Assembly HVM team from 2022/03 till now -Qualcomm HVM device yield management and quailty issue handling