Sidney Chou

EV Stratety & BD / R&D Leader • Taipei，TW • [email protected]

I have over 5-year automotive development and 14-year consumer product experiences from system architecture to mass production.

I am optimistic and open-minded that I enjoy being with people and like to have fun with people around me. And, I can also stay calm and serious when a business is seriously concerned.

I always have my work well planned and then carried it out effectively.

I’d love to play a role of a good assistant.

I can be a winged steed and now I am looking for a real good horse master.

CORE COMPETENCE

1. Business Strategy and Development

Analyze the EV industry dynamics, market demand research and TAM/SAM/SOM market size assessment to explore potential business and partnership opportunities.
Interpret market, customer, and competitor information to set GSSP (Goal, SWOT, Strategy and Plan) to advise top managers of market potential, strategies, and customer positioning for business development. 
Collaborate with internal investment, legal, sales, tax, accounting, risk management, engineering teams and external resource, MIH to engage customers from MoU, Term Sheet and DA for M&A, Joint-Venture, Strategic Alliance, and new business models.

2. New Technology Solution Team Leader and Director

Team build up from zero to marketing research, business strategy, project plan, feature definition, new field technology and testing equipment survey and implementation.
Familiar with Smart Phone/Wearable/IoT system integration and Core Processor (Application & Baseband processor) architecture.
Well innovation prototyping and process improvement for long-felt needs of product design.

3. Project Leader and Technical Manager

Well project management in matrixed engineering team environment.
Well organizational skill with the ability to prioritize and manage competing demands.
Well analytical skills with proven ability in project development.
Well concept project architecture and cost analysis for product segment strategy.

4. Manager Leadership and Personality

Well communication skill, project issue solving and capability of independent/team work.
Well employees' loyalty, and follow company’s rule and strategy.
Work hard with effective performance and flexible response. l Optimistic and aggressive personality.

SUMMARY OF QUALIFICATIONS

1. Technology Day I. Hon-Hai Tech Day (HHTD20 – HHTD22)

Hon Hai Tech Day (HHTD) is the annual technology event by Foxconn Technology Group. 
3-year experience in HHTD event planning and execution include physical and 3D virtual exhibition.

2. System Device Level

I. Smart Phone

12-year experience in project system architecture include WCDMA, CDMA2000, TDSCDMA, SVLTE, SRLTE, SGLTE, VoLTE, SSSA/DSDS/DSDA/TSDA Smartphone design and work with Qualcomm, Broadcom, nVidia, Intel, TI, Mediatek SoC vendors.
10-year experience in EVM (evaluation module) kit and Prototype device for early product development and debugging.

II. Smart Watch and Band

2-year experience in project system architecture includes sensor fusion design.
1-year experience in EVM for product development and debugging.

III. Smart Glass

1-year experience in project system architecture and implementation.
1-year experience in EVM and Prototype device for project development and debugging.

IV. Automotive ADAS

2-year experience in Automotive ADAS HW/SW system architecture, project feature definition, and implementation.

V. Surveillance

1-year experience in Surveillance product applications, HW/SW system architecture, project spec definition, implementation and testing.

3. System Accessory Level

I. Smart Phone

2-year experience in accessory design for product variety and application extension

4. IC Level

I. RTL Coding

6-year experiences in CPLD/FPGA coding design for smart phone system integration.

II. APR Implementation

6-month experience in 7nm Test Chip APR (Automatic Placement and Routing) implementation

III. Custom IC Implementation

4-year experience in Custom IC design spec definition, verification, implement into project till MP for Smartphone product feature requirements.

5. IC Packge Level

I. SiP (System in Package)

1-year experience in SiP system architecture with CPU and third party vendors for project development and debugging.

II. 3DIC (Info and CoWoS)

6-month experience in 2.5D/3D IC architecture, design flow and implementation.

EXPERIENCES

Automotive / EV strategy and business development, Foxconn Corporation Inc, Apr 2020 ~ Now

Title: Director (Chairman Office / EV Policy, business development and PMO management)

Supervisor title: Chairman / CPO

Responsibility:

1. Collect, divide, and conquer EV market trends, demands and business opportunities.

2. Develop EV business strategy and plan for different regions and customers.

3. Define, maintain, and ensure EV project management standards and assist BG/BU to phase in new business and solution.

4. Plan and execute HHTD event for annual technology exhibition.

Achievement:

1. EV business strategy, operation, revenue model planning.

2. Customer engagement, contract negotiation and project management.

3. MIH Open EV Alliance initialization and definition.

4. Tech Day event planning and execution. 5. EV metaverse intrapreneurship for on-line car showroom and shopping.

Automotive ADAS and Surveillance, Primax Corporation Inc, Sep 2017 ~ Jan 2020

Title: Director (CTO Office / SSG BU, New technology and product development)

Supervisor title: CTO / BU Head

Responsibility:
1. Product business strategy and innovative technology planning.
2. Automotive ADAS HW/SW system architecture design, implementation and verification.
3. Surveillance HW/SW system architecture design, implementation and testing.
4. Assist project team (BU) to phase in new solution.
5. Define strategy to enhance product quality.

Achievement:
1. Automotive ADAS product strategy, system architecture, prototype design and development.
2. Surveillance product strategy, system architecture, prototype design and testing.
3. Deep Learning Model training and inference development for obstacle detection via Camera.
4. AI camera and Radar sensor fusion.

Smart Glass and IC Design, TSMC Corporation Inc, Mar 2016 ~ Sep 2019

Title: Tech. Manager (DTP, System and Chipset Development Solution Division, Embedded System Platform Team)

Supervisor title: Department Manager

Responsibility:
1. Mobile SoC platform and system architecture design, implementation and verification.
2. New area (Mobile, IoT, AR/VR, Automotive, HPC) platform architecture study for performance analysis, optimization and KPI definition.
3. IC design APR implementation.
4. 2.5D/3D IC (Info and CoWoS) implementation.

Achievement:
1. Smart glass prototype design and development.
2. 2.5D/3D IC package implementation.
3. 7nm Test Chip APR (Automatic Placement and Routing).

Smart Phone / Smart Watch / Smart Band, HTC Corporation Inc, Aug 2003 ~ Feb 2016

1. Dec. 2008 ~ Feb. 2016

Title: Sr. Tech. Manager (~2016/02, New Technology, Core Team Leader) Manager (~2014/09, New Technology, Core Team Leader) Assistant Manager (~2013/11, New Technology, Core Team Leader)

Supervisor title: VP

Responsibility:
1. CPU platform architecture study include AP, CP, GPU, Sub-Microprocessor, DSP, I/O, Bus and evaluation to propose proper solution to concept study and project teams.
2. New platform architecture performance analysis, optimization and KPI definition for CPU, GPU, memory, power (DoU & Thermal), display and camera.
3. Custom solutions for HTC innovative technology planning and company strategy.
4. Make market competition analysis with technical perspective and quarterly technical roadmap for project teams. 5. Create and verify new CPU EVM and Prototype to shorten project development schedule and enhance testing process

Achievement: Support project team for product plan, early development and fix issues.

2. Aug. 2005 ~ Nov. 2008

Title: Pr. Engineer (~2008/11, Solution and Support team leader) Sr. Engineer (~2006/04, Solution and Support team leader)

Supervisor title: Manager

Responsibility:
1. New chipset study, design and function verification (CPU, Programming IC, USB, TV-OUT…etc).
2. Customer requirement (Verizon, AT&T…etc) checking for project design and strategy.
3. Project initiation, design document preparation and issues tracking to feedback project design.
4. Firmware/Software coding (CPLD, FPGA, Micro-Processor) to follow project plan.
5. HTC own and customized accessory design (HTC Extend mini-USB/Micro-USB, Normal/HTC/BT/FM Earphone, Cradle, USB/Debug/Video-OUT Cable design...etc.)

Achievement: Support project team for early development and fix issues.

3. Aug. 2003 ~ Jul. 2005

Title: Engineer (Project Logic Design team member)

Supervisor title: Pr. Engineer

Responsibility:
1. Project design, debug and maintain till MP.
2. CPLD coding and to meet project design.

Achievement: Dopod 818, Dopod 818 Pro.