Liu, Yen Chu | 劉晏初
Hi, I am Yen Chu, application support engineer in ASML. Besides from the engineer technique, I am also proficient in technology marketing, industrial management and project planning.
Hsinchu，TW
[email protected]
Skills
Programming
Python, Matlab, Javascript, Java, Ruby, C/C++/C#(basic).
Optimal knowledge
Lithography analysis skill, Fab patterning knowledge, POB abberation analysis, chip layer overlay simulation and anaysis, OPC recipe(bacis).
Others
Soft skills: Communication skill, project planning, good collabrate skills and execution ability.
Office: Excel, Powerpoint, Word, Outlook, OneNote, etc.
Photo: Photoshop, Lighroom.
Work Experience
ASML Holding N.V. (Mar. 2018 - Present)
Company profile: A Dutch company and currently the largest supplier in the world of photolithography systems for the semiconductor industry, supporting companies like Intel, TSMC, Samsung, and etc.
NPI Overlay Competency Engineer/ Core Competency Leader ( Jun. 2020 - Present)
Job description: Support customers on product issue solving, New product/function roll out, process strategy evaluation and new process development.
Awards: 1 time Continuous Improvment award and 1 time Spot Awards
Main Achievement:
- Integrate NL HQ and TW competency resource to install worldwide first NXE3600D in tsmc RD team.
- New product rollout to support tsmc N3/N2 production.
- Knowledge sharing to all ASML site in order to prevent business impact on worldwide product market.
Field Application Engineer (Mar. 2018 - Jun. 2020)
Job description: Proccess optimization and solve escation issues for customers. Translate customer requirement into potential business development
Awards: 1 time Best supporting engineer and 1 time Spot Award.
Main Achievement:
- Assist new node N3/N5/N7 successfully rollout.
- Develop new tooling for first line engineer to solve customer issues.
Education
National Sun Yat-sen University Sep. 2014 - Jun. 2016
Master of material and optoelectronic science
Lab: Nano and amorphous material laboratory
Ｍaster's dissertation: Nanoporous structure fabricated by dealloying AgAl thin film through supercritical fluid corrosion
Honor: 2015 IUMRS ICA Outstanding Researches
(Topic : Electrochemical Noise Analysis of Ag Content on the Nanoporous During De-alloying of Al-Ag Alloy )
Yuan Ze University Sep. 2010 - Jun. 2014
Bachelor of chemical engineering and material science
Lab: Advanced Semi-conductor Packages and Material laboratory
Language
Mandarin (native), English (fluent), Japanese (simple), Hakka (fair)
Journal Paper Publication
1. Y. C. Liu, J. C. Huang, X. Wang, Z. K. Wang, Nanoporous foam fabricated by dealloying AgAl thin film through supercritical fluid corrosion, RSC Advances, 2018.
2. Jacob Huang, Wang Xu, Yang Zhao, S. Y. Chen, Y. C. Liu, and Ming Wu, Electrochemical noise analysis of Silver content on the nanoporous during de-alloying of Al-Ag alloy, ECS Journals, 2016.
Other Experience
Substitute Civilian Serviceman, Dec. 2016 - Dec. 2017
Regular Service
Served at The Legal Department Executive Administrative Agency.
Achievements: Best performance of the month
Young Entrepreneur of Future, Feb. 2016 - Nov. 2016
Taiwan delegate
Selected out of 203 participants to visit enterprises and universities in the New York and Boston.
Achievements: Design a wearable device using tACS (transcranial alternating current stimulation) to increase concentration.
International Union of Materials Research Societies - International Conference in Asia, 24th Nov. 2015
Delegate
Annual competition of material science, over 100 groups attend every year.
Achievements: Outstanding Researches 2015
