姜媚庭

 (Mei-Ting Chiang)

Dry Etch Processing Engineer

  Taiwan, Taoyuan

I am a lively and outgoing person, good at communicating with people. I love accepting new challenges and knowledge.  I have been a failure Analysis engineer in Inventec for two years.

From high school to a master's degree, I especially like experimental courses. Because I can get access to different experiments and instruments. After I graduate, I enter the workforce  where I get to apply what I have learned in school.

I'm not only an engineer, but also a marathon runner. Running can temper my willpower, perseverance and stress resistance. This lets me to have better emotional management, like customer feedback or complicated work, etc.

Education


Sep 2016 - Jun 2018

National Chung Hsing University 

Department of Materials Science & Engineering

Dissertation: Wafer-size graphenes deposited on Cu/quartz substrates by inductively coupled plasma enhanced thermal chemical vapor deposition

GPA:4.19

Scholarship: 2017  Huatong Computer Co., Ltd. Merit Scholarship




Sep 2012 - Jun 2016

Yuan Ze University

Department of Chemical Engineering & Material Science

Dissertation: Using Atomic Layer Deposition to Fabricate Pt Catalysts for Methanol

Score: 81.31

scholarship:  103, 104, 105 Asian Cement Scholarship (total 5 times)

Work experience


Dry Etch process engineer

Micron Technology

May 2022 - Present
Taoyuan, Taiwan

  • Responsible for etching process improvement and development projects
  • Responsible for equipment research and development (cooperating with manufacturers) technology transfer and mass production
  • Product yield monitoring, analysis and improvement
  • Support process/production/equipment issues

failure analysis engineer

Inventec

May 2019 - Apr. 2022
Taoyuan, Taiwan

  • Product reliability testing, reliability analysis report, solving and answering customer problems
  • Familiar with the product process
  • Using 2.5D to measure dimensions
  • Using SEM/EDS to analyse some issues
  • By CTE measurement to know the mismatch of PCB and components
  • Strain Gage test

skills

Analysis Tools

  • SEM/EDS
  • FTIR
  • X-RAY
  • 2.5D

Software

  • Microsoft Office Word/ Power Point/ Excel
  • Matlab
  • Minitab


Languages

  • Chinese ★ ★ ★ ★ ★ 
  • English  ★ ★ ★