Pin-Jun Chen
Northeast Asia 5G Management Trainee at Ericsson Group
5G Elite Trainee in Market Area North East Asia (MNEA) at Ericsson Group, based in Taipei, Taiwan. Former International Scholar at KU Leuven who focused on advanced electronic packaging technology, which is commonly used in IC and ICT industries. Moreover, I have served as an R&D Intern at imec, Belgium, a HW Intern at Qualcomm, and a Graduate Research Assistant at TSMC research center in NCTU, Taiwan.
Skills
Languages
Chinese
・
Native or Bilingual
English
・
Professional
Japanese
・
Beginner
Work experiences
Northeast Asia 5G Management Trainee
Ericsson
Nov 2020 ~ Present
5G Elite Trainee Program in North East Asia
• Under the coaching of the President of Ericsson Taiwan, Chafic Nassif.
• Be rotated in three core departments of Project Management, Product Management, and Sales within two years.
• Support the key account management (KAM) team with product and solution expertise focusing on 5G projects.
Research and Development Intern
Interuniversity Microelectronics Centre (imec)
Jan 2020 ~ May 2020
・
5 mosWafer Bonding Assembly Team
• Designed and conducted a novel process to fabricate 3D microfluidic devices with dry film resistance (DFR) technology.
• Manipulated laminator, bonder, and SAM to investigate the optimal parameter for the DFR process.
Hardware Engineering Intern
Qualcomm
May 2019 ~ Nov 2019
・
7 mosReliability Engineering Team
• Learn the product level reliability evaluation for leading-edge silicon process technology on mobile products.
• Learn how to use statistical analysis (Weibull, Lognormal), reliability tools or software, HTOL oven, and ESD machine.
Graduate Research Assistant
Taiwan Semiconductor Manufacturing Company (TSMC)
Sep 2017 ~ Sep 2019
・
2 yrs 1 moTSMC Research Center in NCTU (交大－台積電聯合研發中心)
• Under the supervision of Prof. Chenming Hu, former CTO of TSMC, from UC Berkeley.
• Collaborated with TSRI and NCTU-UCB Joint Center for Intelligent Semiconductor Technology to develop a novel process for next-generation Monolithic 3D BEOL FinFET.
Research Intern
Industrial Technology Research Institute (ITRI)
May 2018 ~ Apr 2019
・
1 yr 0 mosElectronics and Optoelectronic System Research Laboratories
• Used different materials as passivation layers to investigate low-temperature Cu-to-Cu bonding technique.
• Utilized ANSYS APDL to analyze transient thermal conduction problem in different models and boundary conditions.
Undergraduate Research Assistant
The Chinese University of Hong Kong (CUHK)
Jul 2017 ~ Aug 2017
・
2 mosDepartment of Chemistry
• Research topic: Synthesis of Sonogashira Cross-Coupling Reaction.
• Used Pd catalyst to synthesize over 20+ types of compounds to investigate the Sonogashira coupling mechanism.
Summer Intern
Academia Sinica
Jul 2016 ~ Sep 2016
・
3 mosInstitute of Chemistry
• Research topic: The Conductivity Shift of PEDOT Derivatives.
• Used four-point probe measurement and Autolab to analyze the conductivity for 10+ kinds of conducting polymer.
Educations
Katholieke Universiteit Leuven
Other・Faculty of Science
2020 - 2020
Description
One-year full sponsorship by KU Leuven and imec.
National Chiao Tung University
Master of Science (MS)・International College of Semiconductor Technology
2017 - 2020
・
4.1/4.3 GPAActivities and societies
NCTU Xin Guang Project :
• Teach Chinese, Math and Sciences classes to the 3rd- and 4th- grades aboriginal children in Xin Guang Elementary School, located in remote mountains area in Hsinchu county.
Description
• Research Field: 3D heterogeneous integration, Low-temperature Cu-to-Cu bonding, Thermal simulation of 3D IC
• Core Courses: Semiconductor Process, Semiconductor Physics, and Devices, Theory and Modeling of Semiconductor Nanostructures, Reliability and Failure Physics of Semiconductor Devices, Material Analysis, 3D Integrated Circuit.
• Under the supervision of Prof. Kuan-Neng Chen, collaborating with Taiwan Semiconductor Research Institute (TSRI), Industrial Technology Research Institute (ITRI), UC Berkeley, and Center for Semiconductor Technology Research in NCTU.
• Master Thesis: Process Development and Simulation Analysis for Lowering Thermal Budget on Stacking/Monolithic 3D Integrated Circuits.
National Tsing Hua University
Bachelor of Science (BS)・Department of Materials Science and Engineering
2013 - 2017
・
3.6/4.3 GPAActivities and societies
NTHU Graduation Student Association,
NTHU Astronomy Summer Camp,
NTHU MSE Summer Camp,
NTHU Hualien Alumni Association,
NTHU MSE Departmental Badminton Team,
NTHU Drama Club,
NTHU Children Caring Club,
Young Entrepreneurs of the Future
