ADTT PVD Sr. Engineer
Micron Technology 台灣美光
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Full-time1.Published Micron internal paper in FY22.
2.TF line yield owner, and scrap wafer improve around 40%.
3.Contact Co/SICONI recipe optimization.
4.Digit line W sputter recipe development for RS reduction.
5.W/SIN capacity improve 5%~8% for max out project.