Sr Equipment Engineer
Taiwan Semiconductor Manufacturing Company
1. In 300mm wafer fabrication field, specifically at WET department clean/etch tools
2. Manage and start-up projects for productivity, tool quality, and hardware defense system
3. Leading team member, solving issue of production event, and assisted with section Q-sponsor
4. Award and Achieves
– Develop Wafer broken Detection system
– Process productivity outperform. WPD gain 1200pcs/day
– WET tool project, CRC process tools particle F/R improved from 2.7% to 0.5%