郭婷怡, TING-YI KUO

Presently working at Taiwan Semiconductor Manufacturing Company, Ltd., Fab-12 Yield Excellence Department, with one year working experience focusing on FEOL EPI defect improvement as well as SEM, TEM analysis, not only familiar with defect measure approaches, but also love to solve problems as well as sharing opinions with others, so as to achieve target.

Apply position : Process Integration Engineer, R&D Engineer, Q&R enigneer, customer support engineer
Residence : Keelung, Taiwan
Email : [email protected]

Tel : 0936332991

Education

National Central University, Master（MS）, Department of Chemistry, 2018 ~ 2020

1. During my master career at National Central University, I also study the materials of self-assembly supramolecular gel, and organic luminescent materials at the Academia Sinica, mainly engage in organic synthesis, UV-Vis, fluorescence, PXRD.

2. In 2018~2019, I was a teaching assistant in general chemistry experiments, helping students to prescribe the chemical and solutions they needed. Additionally, I focused on the topic of organic materials which has an outstanding ability to form gel as well as possessing aggregation-induced enhance emission, can also divided into ''multiple external stimuli responsive behaviors".

Tamkang University, Bachelor（BS）, Department of Chemistry, 2014 ~ 2018

Graduated from Tamkang University, Department of Chemistry in 2018, maintained my curricular performance above top 15 during the junior semester. I also learned biochemistry and did biochemical experiments such as buffer configuration, gel electrophoresis during the junior semester.

Working Experience

Taiwan Semiconductor Manufacturing Company, Ltd., Engineer, Fab-12 Yield Excellence Department, 2020/11/23 ~ present

1. To begin with my initial duties, I was mainly responsible for analysis work, relating to FEOL EPI loop defect. Thanks to our team members' contributions, not only solve basic defects (ex: particles, remain defect issues) benefits companies by keeping our yield improve, we also ameliorate the pattern defect which was related to yield.

2. Second, I am familiar with defect measure approaches and know the mechanism of relative equipment. The principle of SEM, which is used to confirm the defect images, analyzing whether there is an abnormal or not; as for TEM, it can be much accurately analyze the root cause of defect formation, leading engineers to improve the issue we face with.

Skills

Professional field:

Defect analysis; Measurement equipment & method: KLA, EBI, SEM, TEM

English:

TOEIC 690

Computer:

Microsoft Office, VBA, Klarity.