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<html><head></head><body><div class="row snippet-profile-001"><div class="col-sm-2"><img data-no-retina="true" src="https://img.cakeresume.com/cdn-cgi/image/fit=scale-down,format=auto,w=1200/https://images.cakeresume.com/william-c6e935/484cde29-4bd9-40ec-8112-fb4ce2df6f82.png" alt="Profile 00 00@2x" style="border-top-left-radius: 50%; border-top-right-radius: 50%; border-bottom-right-radius: 50%; border-bottom-left-radius: 50%; aspect-ratio: 274 / 268;" loading="" srcset="https://img.cakeresume.com/cdn-cgi/image/fit=scale-down,format=auto,w=640/https://images.cakeresume.com/william-c6e935/484cde29-4bd9-40ec-8112-fb4ce2df6f82.png 640w, https://img.cakeresume.com/cdn-cgi/image/fit=scale-down,format=auto,w=828/https://images.cakeresume.com/william-c6e935/484cde29-4bd9-40ec-8112-fb4ce2df6f82.png 828w"></div><div class="col-sm-10"><h1><b>William Hsu</b></h1><p>Hi, I’m William, an IC packaging engineer in ASE Inc for almost 4 years. Now, I’m on-site support in the US office for 3 months. In the past years, I was responsible for NPI and cooperate with many tier-1 IC design houses for their products get into the market. Being a customer engineer integration engineer, I provide the package solutions and the assembly process design/improvement for customer. Also, there is new technology development in factory and industry, I also introduced them for customer and suggest the possible solutions for their new products. I enjoy my work and trust you will give my application kind consideration and hoping to hear favorably from you at your convenience.</p><div class="edit"><div class="social-links"><a href="http://linkedin.com/in/william-hsu-74859961" target="_blank" rel="nofollow noopener"><i class="fab"></i></a>&nbsp;</div></div><p>Sr. Engineer <br>San Jose, US</p><p>Taoyuan, Taiwan<br><a href="mailto:minstyle011@gmail.com" target="_blank" rel="nofollow noopener">minstyle011@gmail.com</a></p></div></div><div class="row snippet-experiences-013"><div class="col-xs-12"><div class="row"><div class="col-xs-12"><h1><b>Work Experience</b></h1></div></div><div class="row" title=""><div class="col-xs-2 col-sm-1 item-bullet"></div><div class="col-xs-10 col-sm-11 item"><h3>ASE Group, Customer Engineering Integration Engineer, Oct 2015 ~ Present</h3><p>1. Support customer's NPI from engineering to qualification and mass production. <br>2. Provide IC package solutions and assembly process design/improvement.</p></div></div></div></div><div class="row snippet-educations-013 snippet-experiences-013"><div class="col-xs-12"><div class="row"><div class="col-xs-12"><h1><b>Education</b></h1></div></div><div class="row" title=""><div class="col-xs-2 col-sm-1 item-bullet"></div><div class="col-xs-10 col-sm-11 item"><h3>National Taipei University of Technology, Master’s Degree, Material Science, 2013 ~ 2015</h3></div></div></div></div></body></html>

William Hsu Hi, I’m William, an IC packaging engineer in ASE Inc for almost 4 years. Now, I’m on-site support in the US office for 3 months. In the...

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I’ve been working as customer engineering integration engineer in Advanced Semiconductor Engineering, Inc. since 2015. Started as Customer Engineer to bring customer products to market and develop new package solution for customer next generation products. In past years, I participated in many projects with different packages include Automotive, Flip Chip, SiP and traditional IC packages with many tier-1 IC design houses. My passion lies in exploring possibilities in life. To me, it’s all about to make human a better life.