吳育勳（Casper Wu）
With 12 years of experience in the IC test industry.I have a good knowledge of Logic IC and Memory tests and CP & FT test process. Understand the IC design and manufacturing fornt-end & back-end.
I worked as an CP product engineer at KYEC,then worked as product Integration engineer at eMemory (NVM IP desigh house).My major job function is building test program ,check the IC function and parameter,Electronic Failure Analysis and IC relibility Engine.
Home: 苗栗縣竹南鎮大埔里7鄰大埔101-3號
[email protected]
Cell:0912-008701
Summary
1.UNIX & UNIX like systerm
2.EXCEL VBA,Perl,shell script,C/C++
3.Prober & handler control
4.Automatic Test Equipment(E320,HP93K,J750,D10,Kalos...)
5.oscilloscope & multimeter
6.SSE & DI Burn-in system
Skills
1.CP＆FT Test
2.Build Logic & Memory IC test program
3. Electronic test & analysis by IC tester
4.Burn-in test＆Relibility (HTOL,ELFR....)
5.report automation by VBA & perl
6.non-volatile memory(非揮發性記憶體)
7.volatile memory(DDR2,DDR3....)
Experince
2007/JUL - 2008/JUL
Army 10th Corps Command Headquarters Company Musician
2008/AUG - 2009/JNU
SPIL Mix-signal unit Product Engineer (in shift)
Job function:
1.Maintain product & test program
2.To monitor the test quality & to verify the abnormal sample
3.Trouble shooting with production line
2009/SEP - 2012/OCT
KYEC LCP(Logic CP test unit)
Product Engineer
Job function:
1.Production Report
2.NPI
3.build test program & maintain it
4.solve the process issue
5.yield improment
6.Engineering Analysis
7.Probe Card maitain
8.Major production:Cell phone IC，USB driver，Digital TV IC
2012/OCT - 2017/JUL
eMemory Integration engineer Dept.
Product Integration engineer
Job function:
1. Test & correlation NVM /Electronic Failure Analysis
2. To develop the NVM test program
3. NVM relibility & yield improve
2022/JUL - now
Winbond Electronics Corporation Specialty DRAM Product Development Dept.
Test engineer
Job function:
1. DDR2/DDR3 Core/speed Failure Analysis
2. To develop the FT test program
3. NPI
4. yield improve
School Record
School：Taichung Municipal Feng-Yuan Senior High School(Taiwan)
Major： General Education
During：2000／08～2003／06
School：Feng Chia University,FCU(Taiwan)
Major： Department of Electronic Engineering
During：2003／09～2007／06
A term paper：Investigations on Doubleδ-Doped Al0.3Ga0.7As/InxGa1-xAs/GaAs Doped-Channel Heterostructure Field-Effect Transistors
Link:http://dspace.lib.fcu.edu.tw/handle/2377/3763
Performance
TDTP(Test data transfer program)
Batch processing by VBA which is reduce human resources!!
CP Test Bin map overlay tool
I used Excel VBA auto analysis wafer fail bin's location by numerical & Infographics.Show the defact for customer & manager.
Read Disturbance time calculate tool
I used VBA & GNU plot to calculate & plot the read disturb times by chart
NeoEE report systerm
Tester booking & record alarm system
Oven Temp. logger alarm function
Building a perl program to replaces the logger alarm function.
About me
I am Casper,38 years old.I have been married for five years.Then,I live in Chu'nan town in Miaoli county with my wife.My wife is work at Chipbond as a QA engingneer. Now,we have two sons which the older one is 3 years old and the younger one is 6 months old and have a happy family.
I was employed at SPIL as a product engingneer.The main job function is to handle the mixed- signal IC test process.It make me got the knowledge about the IC test.During the five months,I konw the CP & FT process and how to use Automatic Test Equipments(J750,HP93K,Flex......) to get the test data & shmoo.
My second job was employed at KYEC as a CP product engingneer.The job let me to understand what logic IC test is and how to use tools(VBA or perl) or methods to analyse the test data more effectively.It's also let me to get the frame about IC tester because KYEC used the in-house tester,E320.After 3 years later,I wont to learn more detail about IC development & test program development.So,I tried to find the now job.......
My third job was employed at eMemory(non-volatile memory IP design house) as a product integration engineer.We builded test program & verified the IP circuit by ourself.In here,I have ever be test in 3 types form about memory(NeoBit as OTP,NeoEE as EEPROM,NeoMTP as MTP).In the five and a half years,I learn how to control the progress and the schedule by Gantt Chart and how to discuss with R&D engineer or manager then fix the bug in production.
My fourth job are service at Winbond as a test engineer in Specialty DRAM Product Development Dept .The Major job function is focus on final test for now production correlation & debug .We support product engineer to analyse the process issue.
Now,I want to change a new job.I hope that the above work experience can bring substantial help to the company in the next job, and hopes to get more growth from the new job.
