Bruce Hsieh
Package design and substrate planning manager
v Master of material science technology
v 10 years experience in assembly industry, including
- 3 years wire bonding process experience for lead frame base product
- 6.5 years package design experience for NAND flash product with wire bonding and flip chip product. Package type include BGA base product (MCP / PoP )
- 0.5 year substrate planning experience
v Key achievement
- Focal team leader to achieve major customer annual audit successfully
- Manage new product development from design till mass production
- Leading team to accomplish customer annual project with cross function team
v Phone no. :
0972-393331
v e-mail :
[email protected]
Skills
Languages
English
・
Intermediate
Work experiences
Principal Engineer
NXP Semiconductors Taiwan Ltd. 台灣恩智浦半導體股份有限公司・Full-time
Apr 2022 ~ Present
As a project leader for new product or new technology or new material development. The role need to work with internal cross function team, business unit, quality and engineering team for project development. While development need,
1. from assembly process, package design, selected material point of view to create risk assessment
2. prepare development proposal including development schedule to meet production plan.
3. work with OSAT or production line to complete process window study to make sure qualification quality
Substrate material planning manager
Powertech Technology Inc.
Jun 2021 ~ Present
1. Leading 6 members team for substrate planning
2. Work with procurement to define long term substrate allocation and strategy
3. Inventory and excess material control
4. Be coordinator to work with x function team to come out disposition for substrate incoming issue
R&D manager
Powertech Technology Inc.
Apr 2019 ~ Jun 2021
・
2 yrs 3 mos1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate deign
R&D section manager
Powertech Technology Inc.
Jun 2016 ~ Apr 2019
・
2 yrs 11 mos1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate design
R&D senior engineer
Powertech Technology Inc.
Jun 2014 ~ Jun 2016
・
2 yrs 1 mo1. Project management :
1-1 New product development from design till mass production
1-2 Cost reduction project
2. Trouble shooting, define design rule and upgrade regularly
3. New direct material development (wire /compound / solder ball / die attach film)
Wire bond process engineer
SPIL
Sep 2010 ~ Jun 2014
・
3 yrs 10 mos1. Wire bonding process engineer main job function
1-1 new product process condition and loop setting
1-2 New Cu wire and capillary development
1-2 trouble shooting while new product development
2. Focal team leader for new device qualification
3. Mass production trouble shooting and throughput enhancement
Educations
National Taiwan University of Science and Technology
Master’s Degree・Material Science and Technology
2007 - 2009
National United University
Bachelor’s Degree・Material Science and Technology
2003 - 2007
