The position is with SIP (system in package) group within the Division of Qualcomm Technologies. The position offers the candidate a chance to validate RF performance of next generation of wireless products that would shape the future of wireless industry. A successful candidate can also work with a highly motivated team to conduct board-level PCB design, schematic capture, system link budget analysis, and troubleshooting.
1. Harmony & Humanity
2. Strive for Improvement
5. Adjustment and Assimilation
To help people find good jobs and our clients succeed in business.