The position is with SIP (system in package) group within the Division of Qualcomm Technologies. The position offers the candidate a chance to validate RF performance of next generation of wireless products that would shape the future of wireless industry. A successful candidate can also work with a highly motivated team to conduct board-level PCB design, schematic capture, system link budget analysis, and troubleshooting.
台北市信義區松仁路97號10樓
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